IP Library › Granted Patent US 8,980,076
Granted Patent B1
US 8,980,076 · App. 13/740,010 · Granted Mar 17, 2015

Electro-deposited passivation coatings for patterned media

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Quick Facts
Patent No.
US 8,980,076
App. No.
13/740,010
Filed
Jan 11, 2013
Granted
Mar 17, 2015
Kind
B1
Art Unit
1756
USPC
205/119
Abstract

A method of fabricating a magnetic recording disk including providing a magnetic recording layer having a pattern of raised areas and recessed areas formed thereon and providing a mask layer on the raised areas of the magnetic recording layer. The method further including electrodepositing a first protection layer on the magnetic recording layer, removing the mask layer, and depositing a second protection layer above the first protection layer.

Claims (20)

1. A method of fabricating a magnetic recording disk, comprising:

providing a magnetic recording layer having a pattern of raised magnetic areas formed directly on a magnetic portion of the magnetic recording layer, wherein recessed areas are present between the raised magnetic areas;

providing a mask layer on the raised magnetic areas of the magnetic recording layer;

electrodepositing a first protection layer only in recessed areas of the magnetic recording layer;

removing the mask layer; and

depositing a second protection layer above the first protection layer.

2. The method of claim 1 , wherein electrodepositing comprises electroplating.

3. The method of claim 1 , the first protection layer comprises a metal.

4. The method of claim 1 , wherein the first protection layer comprises aluminum.

5. The method of claim 1 , wherein the first protection layer comprises a silicate.

6. The method of claim 1 , wherein the first protection layer comprises an insulator.

7. The method of claim 6 , further comprising baking the first protection layer after electrodepositing and before depositing the second protection layer.

8. The method of claim 1 , where the first protection layer comprises an aluminate.

9. The method of claim 1 , wherein the first protection layer comprises a material selected from a group consisting of aluminum, gold, copper, chromium, ruthenium, platinum and rhodium.

10. The method of claim 1 , wherein after electroplating the method further comprises:

rinsing the first protection layer; and

annealing the first protection layer before removing the mask layer.

11. The method of claim 10 , wherein the masking layer comprises a non-conductive material.

12. The method of claim 1 , wherein the first protection layer has a thickness less than 1 micron.

13. The method of claim 1 , further comprising electrodepositing one or more additional films on the first protection layer before depositing the second protection layer.