IP Library Granted Patent US 9,249,504
Granted Patent B2
US 9,249,504 · App. 14/037,862 · Granted Feb 2, 2016

Method of passivating ultra-thin AZO with nano-layer alumina

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Quick Facts
Patent No.
US 9,249,504
App. No.
14/037,862
Filed
Sep 26, 2013
Granted
Feb 2, 2016
Kind
B2
Examiner
CHEN, BRET P
Art Unit
1715
USPC
427/255.7
Abstract

A method of making an electrical conductor includes depositing an ultra-thin layer including aluminum-doped zinc oxide layer on a surface and using atomic layer deposition to deposit a nano-layer including alumina in contact and conformal with a surface of the ultra-thin layer including aluminum-doped zinc oxide.

Claims (22)

1. A method of forming an electrical conductor, comprising:

depositing an ultra-thin layer having a thickness less than or equal to 100 nm including aluminum-doped zinc oxide layer on a surface;

using atomic layer deposition to deposit a nano-layer including alumina in contact and conformal with a surface of the ultra-thin layer including aluminum-doped zinc oxide; and

locating an electrical contact in electrical communication with the ultra-thin layer including aluminum-doped zinc-oxide through the nano-layer including alumina.

2. The method of claim 1 , further including depositing the ultra-thin layer including aluminum-doped zinc oxide layer by atomic layer deposition.

3. The method of claim 1 , further including depositing the nano-layer including alumina using spatial atomic layer deposition.

4. The method of claim 1 , further including depositing the ultra-thin layer including aluminum-doped zinc oxide using spatial atomic layer deposition.

5. The method of claim 1 , wherein the ultra-thin layer including aluminum-doped zinc oxide has a thickness less than or equal to 100 nm.

6. The method of claim 1 , wherein the nano-layer including alumina has a thickness less than or equal to 5 nm.

7. The method of claim 1 , wherein the electrical resistance between the electrical contact and the ultra-thin layer including aluminum-doped zinc-oxide is less than or equal to 2,000 ohms.

8. The method of claim 1 , wherein the electrical resistance between the electrical contact and the ultra-thin layer including aluminum-doped zinc-oxide is less than or equal to 1,000 ohms.

9. The method of claim 1 , wherein the electrical resistance between the electrical contact and the ultra-thin layer including aluminum-doped zinc-oxide is less than or equal to 500 ohms.

10. The method of claim 1 , wherein the sheet resistance of the ultra-thin layer including aluminum-doped zinc-oxide is less than or equal to 10,000 ohms per square.

11. The method of claim 1 , wherein the sheet resistance of the ultra-thin layer including aluminum-doped zinc-oxide is less than or equal to 5,000 ohms per square.

12. The method of claim 1 , wherein the sheet resistance of the ultra-thin layer including aluminum-doped zinc-oxide is less than or equal to 500 ohms per square.

13. The method of claim 1 , wherein the sheet resistance of the ultra-thin layer including aluminum-doped zinc-oxide is less than or equal to 250 ohms per square.

14. The method of claim 1 , wherein the ratio of aluminum to zinc in the ultra-thin layer including aluminum-doped zinc-oxide is greater than zero and less than or equal to 15%.

15. The method of claim 1 , wherein the ultra-thin layer including aluminum-doped zinc-oxide is a super-lattice having less than 15% aluminum content.

16. A method of forming an electrical conductor, comprising:

depositing an ultra-thin layer having a thickness less than or equal to 100 nm including aluminum-doped zinc oxide layer on a surface;

using atomic layer deposition to deposit a nano-layer including alumina in contact and conformal with a surface of the ultra-thin layer including aluminum-doped zinc oxide; and

locating a plurality of electrical contacts in electrical communication with the ultra-thin layer including aluminum-doped zinc-oxide through the nano-layer including alumina.