Method and apparatus for manufacturing semiconductor device

1. A method for manufacturing a semiconductor device, the method comprising:

forming an insulating film on a front surface and on a back surface of an individual semiconductor wafer,

wherein the front surface is a surface on which a semiconductor element is to be formed, and

wherein the back surface is a surface opposing the front surface;

removing the insulating film formed on the back surface by selectively providing a first chemical on the back surface of the individual semiconductor wafer while flowing nitrogen over the front surface and rotating the individual semiconductor wafer relative to a nozzle supplying the first chemical to the back surface,

wherein the first chemical comprises HF and H 2 O; and

removing the insulating film formed on the front surface by performing a series of operations comprising a HF treatment followed by an APM treatment followed by an HPM treatment.

2. The method for manufacturing a semiconductor device according to claim 1 , wherein the insulating film includes at least one of silicon oxide and silicon nitride.

3. The method for manufacturing a semiconductor device according to claim 1 , wherein the insulating film is a silicon oxide film.

4. The method for manufacturing a semiconductor device according to claim 1 , further comprising:

implanting ions on the front surface of the individual semiconductor wafer prior to removing the insulating film formed on the back surface.

5. The method for manufacturing a semiconductor device according to claim 1 , further comprising:

bringing the back surface into contact with a chuck of a semiconductor manufacturing apparatus prior to removing the insulating film formed on the back surface.

6. The method for manufacturing a semiconductor device according to claim 1 , wherein the forming the insulating film comprises forming a tunnel oxide film.

7. The method for manufacturing a semiconductor device according to claim 1 , wherein the series of operations are performed simultaneously on a plurality of semiconductor wafers comprising the individual semiconductor wafer such that the back surface of the individual semiconductor wafer faces a front surface of another wafer of the plurality of semiconductor wafers during at least the HF treatment.

8. The method for manufacturing a semiconductor device according to claim 1 , wherein the individual semiconductor wafer is suspended above a stage facing the front surface of the individual semiconductor wafer by flowing the nitrogen.

9. The method for manufacturing a semiconductor device according to claim 8 , wherein the individual semiconductor wafer is rotated by rotating the stage.

10. The method for manufacturing a semiconductor device according to claim 8 , wherein flowing the nitrogen over the front surface and between the stage and the front surface prevents the first chemical from contacting the front surface of the individual semiconductor wafer.

11. The method for manufacturing a semiconductor device according to claim 1 , wherein the first chemical is jet sprayed from the nozzle onto the back surface of the individual semiconductor wafer.

12. The method for manufacturing a semiconductor device according to claim 1 , further comprising, prior to forming the insulating film, performing ion implantation of dopants into the front surface of the individual semiconductor wafer.

13. The method for manufacturing a semiconductor device according to claim 12 , further comprising, after forming the insulating film, performing a thermal treatment to activate the ion implanted dopants in the front surface of the individual semiconductor wafer.

14. The method for manufacturing a semiconductor device according to claim 1 , wherein a concentration ratio of HF to H 2 O in the first chemical is 1:50.

15. The method for manufacturing a semiconductor device according to claim 1 , wherein a concentration ratio of HF to H 2 O in the first chemical is 1:200.

16. The method for manufacturing a semiconductor device according to claim 1 , wherein the insulating film is formed over a shallow trench isolation (STI) oxidation layer disposed on the front surface of the individual semiconductor wafer.