Techniques for manufacturing ingestible event markers comprising an ingestible component

1. A method of manufacturing a tablet comprising an electronic device, the method comprising:

providing a powdered material into a die cavity of a tablet press;

dispensing an electronic device from a tape-and-reel carrier tape operatively coupled to the tablet press, the carrier tape configured for holding the electronic device;

locating the electronic device into the die cavity; and

compressing the powdered material and the electronic device to form a tablet; and

wherein the carrier tape comprises a cover tape and defines a cavity for holding the electronic device between the cavity and the cover tape, wherein dispensing the electronic device from the carrier tape comprises:

removing the cover tape from the carrier tape to expose the electronic device within the cavity;

transferring the cover tape to a pick-and-place transfer mechanism;

picking the electronic device from the cavity with a pick-and-place element of the transfer mechanism;

transferring the pick-and-place element to the tablet press; and

placing the electronic device in the die cavity.

2. The method of claim 1 , further comprising pre-compressing the powdered material prior to locating the electronic device into the die cavity.

3. The method of claim 1 , further comprising providing additional powdered material into the die cavity after forming the tablet.

4. The method of claim 3 , further comprising compressing the additional powdered material to form the tablet.

5. The method of claim 1 , wherein the tablet press is a rotary tablet press.

6. The method of claim 1 , wherein the powdered material is a pharmaceutical material.

7. The method of claim 1 , wherein the electronic device is an ingestible event marker.

8. The method of claim 1 , further comprising locating the pick-and-place element above the die cavity.

9. The method of claim 8 , further comprising:

transferring the pick-and-place element to a carrier;

locating the pick-and-place element above the carrier;

placing the electronic device in the carrier;

picking the electronic device from the carrier with a second pick-and-place element of a second transfer mechanism; and

locating the second pick-and-place element above the die cavity.

10. The method of claim 1 , wherein the pick-and-place element is a vacuum tool.

11. A method of manufacturing a tablet comprising an electronic device, the method comprising:

providing a powdered material into a die cavity of a tablet press;

dispensing an electronic device from a tape-and-reel carrier tape operatively coupled to the tablet press, the carrier tape configured for holding the electronic device;

locating the electronic device into the die cavity; and

compressing the powdered material and the electronic device to form a tablet; and

wherein dispensing the electronic device from the tape carrier comprises:

transferring the carrier tape to a punch press;

punching through the carrier tape comprising the electronic device with an ejector pin portion of the punch press, wherein the ejector pin perforates the carrier tape; and

dispensing the electronic device into the die cavity through the perforations;

dispensing the electronic device into a carrier; and

transferring the carrier to the tablet press.

12. The method of claim 11 , wherein the carrier frictionally engages the electronic device and centers the electronic device with the die cavity.

13. A method of manufacturing a tablet comprising an electronic device, the method comprising:

providing a powdered material into a die cavity of a tablet press;

dispensing an electronic device from a tape-and-reel carrier tape operatively coupled to the tablet press, the carrier tape configured for holding the electronic device;

locating the electronic device into the die cavity; and

compressing the powdered material and the electronic device to form a tablet; and

wherein the carrier tape carrier comprises first and second adhesive tapes for holding the electronic device therebetween, wherein dispensing the electronic device from the carrier tape comprises:

removing the first adhesive tape from the carrier tape to expose the electronic device within the cavity;

transferring the cover tape to a punch press;

punching through the carrier tape comprising the electronic device with an ejector pin portion of the punch press, wherein the ejector pin perforates the carrier tape; and

dispensing the electronic device into the die cavity through the perforations.

14. The method of claim 13 , further comprising:

dispensing the electronic device into a carrier; and

transferring the carrier to the tablet press.

15. A system for manufacturing a tablet comprising an electronic device, the system comprising:

a tablet press comprising a die cavity for receiving a powdered material and an electronic device therein, an upper punch, and a lower punch, wherein the upper and lower punches are operative to form the powdered material and the electronic device into a tablet;

a tape-and-reel carrier tape operatively coupled to the tablet press, the carrier tape configured for holding the electronic device; and

a transfer mechanism to transfer the electronic device from the tape carrier to the die cavity; and

wherein the transfer mechanism comprises a pick-and-place transfer mechanism operatively coupled to the carrier tape and the tablet press.

16. A system for manufacturing a tablet comprising an electronic device, the system comprising:

a tablet press comprising a die cavity for receiving a powdered material and an electronic device therein, an upper punch, and a lower punch, wherein the upper and lower punches are operative to form the powdered material and the electronic device into a tablet;

a tape-and-reel carrier tape operatively coupled to the tablet press, the carrier tape configured for holding the electronic device; and

a transfer mechanism to transfer the electronic device from the tape carrier to the die cavity; and

further comprising a carrier to receive the electronic device and center the electronic device relative to the die cavity, wherein the pick-and-place transfer mechanism locates the electronic device in the carrier.

17. The system of claim 16 , further comprising a second pick-and-place transfer mechanism to pick the electronic device from the carrier, locate the second pick-and-place transfer mechanism above the die cavity.

18. A system for manufacturing a tablet comprising an electronic device, the system comprising:

a tablet press comprising a die cavity for receiving a powdered material and an electronic device therein, an upper punch, and a lower punch, wherein the upper and lower punches are operative to form the powdered material and the electronic device into a tablet;

a tape-and-reel carrier tape operatively coupled to the tablet press, the carrier tape configured for holding the electronic device; and

a transfer mechanism to transfer the electronic device from the tape carrier to the die cavity; and

wherein the pick-and-place transfer mechanism comprises a vacuum tool.

19. The system of claim 18 , further comprising a punch press for dispensing the electronic device from the tape carrier operatively coupled to the tablet press.

20. The system of claim 19 , wherein the punch press comprises a rotating punch wheel.

21. A system for manufacturing a tablet comprising an electronic device, the system comprising:

a tablet press comprising a die cavity for receiving a powdered material and an electronic device therein, an upper punch, and a lower punch, wherein the upper and lower punches are operative to form the powdered material and the electronic device into a tablet;

a tape-and-reel carrier tape operatively coupled to the tablet press, the carrier tape configured for holding the electronic device; and

a transfer mechanism to transfer the electronic device from the tape carrier to the die cavity; and

wherein the carrier tape carrier comprises first and second adhesive tapes for holding the electronic device therebetween.