Package-in-package using through-hole via die on saw streets
View Patent ↗A semiconductor device includes a first die having top, bottom, and peripheral surfaces. A bond pad is formed over the top surface. An organic material is connected to the first die and disposed around the peripheral surface. A via hole is formed in the organic material. A metal trace connects the via hole to the bond pad. A conductive material is deposited in the via hole. A redistribution layer (RDL) has an interconnection pad disposed over the top surface of the first die.
1. A semiconductor device, comprising:
a first semiconductor die;
an insulating material disposed around a peripheral region of the first semiconductor die including a first surface of the insulating material coplanar with a first surface of the first semiconductor die;
a conductive via formed through the insulating material with a side surface of the conductive via coplanar with a side surface of the insulating material;
a bond pad formed on the first surface of the first semiconductor die;
a conductive trace formed between the bond pad and the conductive via; and
a second semiconductor die disposed over the first surface of the first semiconductor die.
2. The semiconductor device of claim 1 , further including an encapsulant deposited over the second semiconductor die and around the insulating material, wherein the encapsulant contacts the side surface of the conductive via.
3. The semiconductor device of claim 1 , further including a third semiconductor die disposed over the first semiconductor die or the second semiconductor die.
4. The semiconductor device of claim 1 , further including a bond wire mechanically bonded to a first surface of the conductive via coplanar with the first surface of the first semiconductor die and the first surface of the insulating material.
5. The semiconductor device of claim 1 , further including a substrate, wherein the first semiconductor die is disposed over the substrate.
6. A semiconductor device, comprising:
a first semiconductor die;
an insulating material disposed around a peripheral region of the first semiconductor die including a surface of the insulating material coplanar with a surface of the first semiconductor die;
a conductive via formed through the insulating material with a top surface, a side surface, and a bottom surface of the conductive via exposed from the insulating material;
a bond pad formed on the surface of the first semiconductor die; and
a conductive trace coupled between the conductive via and the bond pad.
7. The semiconductor device of claim 6 , further including:
a second semiconductor die disposed over the first semiconductor die; and
an encapsulant deposited over the second semiconductor die and contacting the insulating material.
8. The semiconductor device of claim 7 , further including a third semiconductor die disposed over the first semiconductor die or the second semiconductor die.
9. The semiconductor device of claim 8 , wherein the third semiconductor die overhangs the second semiconductor die.
10. The semiconductor device of claim 7 , wherein the second semiconductor die overhangs the first semiconductor die.
11. The semiconductor device of claim 7 , further including a bond wire electrically coupled to the first semiconductor die or the second semiconductor die.
12. The semiconductor device of claim 6 , further including an integrated passive device disposed over the first semiconductor die.
13. A semiconductor device, comprising:
a first semiconductor die;
an insulating material disposed around a peripheral region of the first semiconductor die;
a half-cut conductive via formed through the insulating material; and
a conductive layer formed on a surface of the first semiconductor die and a surface of the insulating material and coupled to the conductive via.
14. The semiconductor device of claim 13 , further including a bond pad formed over the surface of the first semiconductor die and coupled to the conductive via through the conductive layer.
15. The semiconductor device of claim 13 , further including an encapsulant deposited over the first semiconductor die and contacting the insulating material.
16. The semiconductor device of claim 13 , further including a second semiconductor die disposed over the first semiconductor die.
17. The semiconductor device of claim 16 , further including a third semiconductor die disposed over the first semiconductor die or the second semiconductor die.
18. The semiconductor device of claim 16 , further including a bond wire electrically coupled to the first semiconductor die or the second semiconductor die.
19. A semiconductor device, comprising:
a first semiconductor die;
an insulating material disposed around a peripheral region of the first semiconductor die;
a conductive via formed through the insulating material with a side surface of the conductive via exposed at a side surface of the insulating material; and
a conductive trace formed on a surface of the first semiconductor die and extending to the conductive via.
20. The semiconductor device of claim 19 , further including an encapsulant deposited over the first semiconductor die.
21. The semiconductor device of claim 19 , further including a second semiconductor die disposed over the first semiconductor die.
22. The semiconductor device of claim 21 , further including a third semiconductor die disposed over the first semiconductor die or the second semiconductor die.
23. The semiconductor device of claim 21 , further including a bond wire electrically connected to the first semiconductor die or the second semiconductor die.