Circuit module and method of manufacturing the same
View Patent ↗Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (A CONT 1 ), between the intermediate layer and the contact area is less that the surface area (A PAD ) of the contact area.
1. A circuit module, comprising
an insulator layer;
at least one component inside the insulator layer, the at least one component comprising contact terminals with contact surfaces of aluminium;
contact elements on the surface of the contact terminals, the contact elements comprising an intermediate layer of at least one metal other than aluminium directly on the contact surfaces of the component and at least one layer of copper on a surface of the intermediate layer; and
conductor pattern on a surface of the insulator layer and in contact with the contact elements, conductors of the conductor pattern comprising an intermediate layer of the same at least one metal than the intermediate layer of the contact elements and at least one layer of copper on a first surface of the intermediate layer.
2. The circuit module of claim 1 , wherein a contact surface area (A CONT 1 ) between the intermediate layer of the contact element and the contact terminal being less than a surface area (A PAD ) of the contact surface of the contact terminal.
3. The circuit module of claim 1 , wherein the intermediate layer contains titanium.
4. The circuit module of claim 1 , wherein the intermediate layer comprises at least one of zinc and nickel.
5. The circuit module of claim 1 , wherein conductors of the conductor pattern comprise at least one layer of copper on a second surface of the intermediate layer.
6. The circuit module of claim 1 , wherein the contact elements are entirely filled with copper.
7. The circuit module of claim 1 , wherein the intermediate layer extends along the side walls of the contact elements between the contact terminals and the conductors.
8. The circuit module of claim 1 , wherein each contact element comprises a copper core, which connects continuously to at least one layer of copper of the conductors.
9. The circuit module of claim 1 , wherein the conductors comprise
a first layer of copper on the surface of the insulator layer;
an intermediate layer on the surface of the first copper layer; and
a second layer of copper on the surface of the intermediate layer.
10. The circuit module of claim 1 , wherein a width (W CONT ) of the contact surface between the contact element and the contact terminal of the component is 0-20% less than a greatest width (W MAX ) of the contact element in the same direction.
11. The circuit module of claim 1 , wherein a height (H) of the contact element is less than, or equal to a greatest width (W MAX ) of the contact element.
12. A circuit module, comprising
an insulator layer;
at least one component inside the insulator layer, the at least one component comprising contact terminals with contact surfaces of aluminium;
contact elements on the surface of the contact terminals, the contact elements comprising an intermediate layer of at least one metal other than aluminium directly on the contact surfaces of the component and at least one layer of copper on a surface of the intermediate layer; and
conductor pattern on a surface of the insulator layer and in contact with the contact elements, conductors of the conductor pattern comprising an intermediate layer of the same at least one metal than the intermediate layer of the contact elements and at least one first layer of copper on a first surface of the intermediate layer and at least one second layer of copper on a second surface of the intermediate layer.
13. The circuit module of claim 1 , wherein the intermediate layer contains titanium.
14. The circuit module of claim 1 , wherein the intermediate layer comprises at least one of zinc and nickel.
15. The circuit module of claim 1 , wherein the contact elements are entirely filled with copper.
16. The circuit module of claim 1 , wherein each contact element comprises a copper core, which connects continuously to at least one layer of copper of the conductors.
17. A circuit module, comprising
an insulator layer having a first surface and a second surface;
at least one component embedded inside the insulator layer between the first surface and the second surface, the at least one component comprising contact terminals with contact surfaces of aluminium;
contact elements on the surface of the contact terminals, the contact elements comprising an intermediate layer comprising at least one metal other than aluminium directly on the contact surfaces of the component and at least one layer of copper on a surface of the intermediate layer;
a first conductor pattern on the first surface of the insulator layer and in contact with the contact elements, conductors of the first conductor pattern comprising an intermediate layer of the same at least one metal than the intermediate layer of the contact elements and at least one layer of copper on a surface of the intermediate layer; and
a second conductor pattern on the second surface of the insulator layer.
18. The circuit module of claim 1 , wherein the intermediate layer contains titanium.
19. The circuit module of claim 1 , wherein the contact elements are entirely filled with copper.
20. The circuit module of claim 1 , wherein each contact element comprises a copper core, which connects continuously to at least one layer of copper of the conductors.