IP Library Granted Patent US 7,116,523
Granted Patent B2
US 7,116,523 · App. 09/219,195 · Granted Oct 3, 2006

Interconnect module for use in a suspension assembly

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Quick Facts
Patent No.
US 7,116,523
App. No.
09/219,195
Granted
Oct 3, 2006
Kind
B2
Abstract

A lead routing module for interconnecting two devices in a suspension assembly. The suspension assembly including at least a suspension, a slider/head assembly, and a lead routing module. The suspension assembly may also include a microactuator. The lead routing module routes electrical signals between at least two devices in the suspension assembly such that the termination leads and/or pads of each device may be conveniently located. The suspension assembly may be used in a disk drive system, or alternatively, in a disk test system used for testing disks.

Claims (50)

1. A disk drive system, comprising:

a microactuator having a connecting end;

a slider/head assembly position d on th microactuator;

a suspension having a connecting end and electrically conducting paths; and

an interconnect module positioned between the suspension and the microactuator, the interconnect module coupling the connected end of the suspension and the connected end of the microactuator such that the connected end of the suspension is positioned in a first direction and the connecting end of the microactuator is positioned in a second direction.

2. The disk drive system of claim 1 , wherein said suspension is an integrated lead suspension.

3. The disk drive system of claim 1 , wherein said slider/head assembly is orthogonally mounted onto said suspension.

4. The suspension assembly of claim 1 , wherein said electrically conducting paths are attached to said suspension.

5. A suspension assembly comprising:

a slider/head assembly;

a suspension having a connecting end and electrically conducting paths;

a microactuator having a connecting end; and

an interconnect module coupling the connecting ends of the suspension and the microactuator to route one or more data signals between said electrically conducting paths and said microactuator, such that the connecting end of the suspension is positioned in a first direction and the connecting end of the microactuator is positioned in a second direction.

6. The suspension assembly of claim 5 , wherein said suspension is an integrated lead suspension.

7. The suspension assembly of claim 5 , wherein said suspension includes a first set of termination leads coupled to said slider/head assembly and a second set of termination leads coupled to said interconnect module.

8. The suspension assembly of claim 5 , wherein said electrically conducting paths are attached to said suspension.

9. An assembly, comprising:

a first device;

a second device; and

an interconnect device coupled between said first and second devices to route one or more signals between said first and second devices,

wherein said first device is a microactuator and said second device is a suspension.

10. The assembly of claim 9 , wherein said electrically conducting paths are attached to said second device.

11. A storage device, comprising:

a disk;

a spindle motor positioned to support and rotate said disk;

a suspension assembly including an interconnect module coupled between a slider/head assembly and a suspension, said suspension having electrically conducting paths, and said interconnect module routing one or more data signals between said electrically conducting paths and said slider/head assembly; and

a microactuator coupled to said suspension assembly and operable to position said suspension assembly above said disk to access said disk for reading and/or writing operations.

12. The suspension assembly of claim 1 , wherein said suspension is an integrated lead suspension.

13. A test system for disks, comprising:

a spindle motor for rotating a disk during a test operation; and

a test platform including a suspension assembly coupled to an actuator, said actuator operable to position said suspension assembly above said disk to access said disk for said test operation, said suspension assembly including an interconnect module coupled between a slider/head assembly having a connecting end and a suspension, said suspension having a connecting end and electrically conducting paths, and said interconnect module coupling the connecting ends of the slider/head assembly and the suspension and routing one or more data signals between said electrically conducting paths and said slider/head assembly, such that the connecting end of the suspension is positioned in a first direction and the connecting end of the slider/head assembly is positioned in a second direction.

14. The test system of claim 13 , wherein said suspension is an integrated lead suspension.

15. The test system of claim 13 , wherein said suspension is configured for inline mounting of said slider/head assembly.

16. The test system of claim 15 , wherein said slider/head assembly is orthogonally mounted on said suspension.

17. The test system of claim 14 , wherein said electrically conducting paths are attached to said suspension.

18. A storage device, comprising:

a disk;

a spindle motor positioned to support and rotate said disk;

a suspension assembly including an interconnect module coupled between a suspension having a connecting end and electrically conducting paths and a microactuator having a connecting end, the interconnect module coupling the connecting ends of the suspension and the microactuator and routing data signals between said electrically conducting paths and said microactuator, such that the connecting end of the suspension is positioned in a first direction and the connecting end of the microactuator is positioned in a second direction; and

an actuator coupled to said suspension assembly and operable to position said suspension assembly above said disk to access said disk for reading and/or writing operations.

19. The storage device of claim 18 , wherein said suspension is an integrated lead suspension.

20. The storage device of claim 18 , wherein said suspension is configured for in-line mounting of a slider/head assembly.

21. The storage device of claim 18 , wherein said electrically conducting paths are attached to said suspension.

22. A test system for disks, comprising:

a spindle motor for rotating a disk during a test operation; and

a test platform including a suspension assembly coupled to an actuator, said actuator operable to position said suspension assembly above said disk to access said disk for said test operation, said suspension assembly including an interconnect module coupled between a suspension having a connecting end and electrically conducting paths and a microactuator having a connecting end, the interconnect module coupling the connecting ends of the suspension and the microactuator and routing data signals between said electrically conducting paths and said microactuator, such that the connecting end of the suspension is positioned in a first direction and the connecting end of the microactuator is positioned in a second direction.

23. The test system of claim 22 , wherein said suspension is an integrated lead suspension.

24. The test system of claim 22 , wherein said suspension is configured for in-line mounting of a slider/head assembly.

25. The test system of claim 24 , wherein said microactuator is orthogonally mounted onto said suspension.

26. The test system of claim 22 , wherein said electrically conducting paths are attached to said suspension.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040818/0551 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2004
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
Reel/Frame 014708/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 1998
From: LEE, FRANCIS CHEE-SHUAN; MCGHEE, MICHAEL LEE; NAVARRO, SALVADOR; NYAK, ULLAI VASANT; O'BRIEN, ERIC CRHISTIAN; SHUM, WING CHUN; SIMMONS, RANDALL GEORGE
To: INTERNATIONAL BUSINESS MACHINES
Reel/Frame 009669/0313 →