IP Library Granted Patent US 6,919,162
Granted Patent B1
US 6,919,162 · App. 09/233,694 · Granted Jul 19, 2005

Method for producing high-structure area texturing of a substrate, substrates prepared thereby and masks for use therein

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Quick Facts
Patent No.
US 6,919,162
App. No.
09/233,694
Granted
Jul 19, 2005
Kind
B1
Abstract

A method is provided for preparing high-surface area texturing of a substrate using methods by which material from a substrate is subtracted from or added to the surface of the substrate. In one embodiment, the method is a subtractive lithographic method that involves exposing a laser-ablatable substrate, such as a polymeric or ceramic substrate, to laser light. A mask may be used to define the pattern of light incident on the substrate. High-surface area textured substrates, in particular, miniaturized planar analysis devices having high-surface area textured features, prepared by the methods disclosed herein are also provided. A method by which the high-surface area textured substrate or the miniaturized planar analysis device is used as a master from which replicate copies thereof may be made is also provided.

Claims (6)

1. A substrate comprising:

a material selected from the group consisting of polymeric materials, ceramic materials, glass materials, metal materials, and composites thereof; and

a surface having features formed by the treatment of a surface-altering process that utilizes a partially transmissive mask that allows a fraction of light to pass therethrough, the surface area of the treated surface being greater than the surface area of an untreated surface.

2. The substrate of claim 1 , wherein the surface area of the treated surface is at least 1,000 times greater than the surface area of an untreated surface.

3. The substrate of claim 1 , wherein the material comprises a polyimide.

4. An analysis device comprising the substrate of claim 1 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 30, 2000
From: HEWLETT-PACKARD COMPANY
To: AGILENT TECHNOLOGIES INC
Reel/Frame 010977/0540 →
MERGER Recorded Apr 24, 2000
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD COMPANY
Reel/Frame 010759/0049 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2000
From: BRENNEN, REID A.; SWEDBERG, SALLY A.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 010720/0316 →