IP Library Granted Patent US 7,039,228
Granted Patent B1
US 7,039,228 · App. 09/444,034 · Granted May 2, 2006

System and method for three-dimensional surface inspection

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Quick Facts
Patent No.
US 7,039,228
App. No.
09/444,034
Granted
May 2, 2006
Kind
B1
Abstract

An optical inspection system and method for inspecting a component on a printed circuit board (PCB) which determines three-dimensional information in a single scan. A first visual light source illuminates the PCB surface and component with a green light while a second visual light source illuminates the PCB and component with a blue light. At least one laser light source simultaneously illuminates the surface of the PCB with a narrow coherent red-light laser beam. The laser light source is mounted off vertical on a movable mount which enables the laser beam to be directed over an area of interest on the surface of the PCB. The system also includes a color scan camera mounted vertically above the PCB. The camera has red, green, and blue channels. The green and blue channels capture an image of the illuminated surface of the PCB which is used by a computer to determine two-dimensional information about the component. The red channel captures a path of the laser beam as it strikes the surface of the PCB and the component. The computer uses the path to determine height information for the component.

Claims (17)

1. A method of inspecting a structure-bearing surface of an object, said method comprising the steps of:

simultaneously forming a plurality of lines on the surface using light emitted from at least one coherent light source at a first wavelength and strobed at a pre-determined exposure time;

moving the lines with respect to the surface;

capturing an image of the lines as they move with respect to the surface;

determining height information for structures on the surface from the image of the lines;

illuminating the surface of the object with visible light at a second wavelength, the second wavelength being different from the first wavelength;

capturing a second image of the surface illuminated by the visible light at a second wavelength;

determining two-dimensional information for any surface structures by analyzing the second image;

illuminating the surface with visible light at a third wavelength, the third wavelength being different from the first and second wavelength;

capturing a third image created by the visible light at the third wavelength; and

determining two-dimensional information for any surface by analyzing the third image;

wherein the image capturing steps are performed by a camera operable to capture separate images corresponding to light of the first wavelength and of the second wavelength.

2. The method of claim 1 , wherein the plurality of lines form a grid on the surface of the object.

3. The method of claim 1 , wherein the visible light at a second wavelength is emitted by a visible light source that is strobed at a second predetermined exposure time.

4. The method of claim 3 , where in the predetermined exposure time for the coherent light source and the second predetermined exposure time for the visible light source are different.

5. The method of claim 1 , wherein the two-dimensional information is combined with the height information to create a profile of structures on the surface of the object.

6. The method of claim 1 , wherein the height information is determined by integrating a series of height measurements to provide an average height.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2006
From: ISOA INC.
To: RUDOLPH TECHNOLOGIES, INC.
Reel/Frame 017006/0328 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2000
From: PATTIKONDA, RAMAKRISHNA; LIN, YOULING
To: ISOA, INC.
Reel/Frame 010532/0808 →