Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation
View Patent ↗A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.
1. A head assembly comprising:
a mounting surface;
an integrated circuit chip which is mounted on the mounting surface and which processes signals; and
a head slider which is provided with a head and which is mounted on the mounting surface,
said integrated circuit chip being covered by a layer 2 μm or thinner,
a height of the integrated circuit chip, including the layer, being lower than a height of the head slider from the mounting surface,
wherein said layer covers at least peripheral side portions of the integrated circuit chip.
2. The head assembly as claimed in claim 1 , wherein said layer covering the integrated circuit chip is formed by evaporation.
3. The head assembly as claimed in claim 1 , wherein said layer covers at least an entire upper surface of the integrated circuit chip.
4. The head assembly as claimed in claim 1 , wherein said layer covers upper and side surfaces of the integrated circuit chip.
5. The head assembly as claimed in claim 1 , further comprising:
an under-filling filling a gap between a lower surface of the integrated circuit chip and the mounting surface,
said layer covering upper and side surfaces of the integrated circuit chip and peripheral side surfaces of the under-filling.
6. The head assembly according to claim 1 , wherein the mounting surface is substantially flat.
7. A head assembly comprising:
a mounting surface;
an integrated circuit chin which is mounted on the mounting surface and which processes signals; and
a head slider which is provided with a head and which is mounted on the mounting surface,
said integrated circuit chip being covered by a layer 2 μm or thinner,
a height of the integrated circuit chip, including the layer, being lower than a height of the head slider from the mounting surface,
wherein said layer is made of poly(p-xylylene).
8. A disk unit for reading information from and writing information to a disk, comprising:
a head assembly having a mounting surface, a head slider provided with a head and mounted on the mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes information read from and/or written to the disk via the head,
said integrated circuit chip being covered by a layer 2μ m or thinner,
a height of the integrated circuit chip, including the layer, being lower than a height of the head slider from the mounting surface,
wherein said layer covers at least peripheral side portions of the integrated circuit chip.
9. The head assembly according to claim 8 , wherein the mounting surface is substantially flat.
10. A unit for reading information from and writing information to a recording medium, comprising:
a head assembly having a mounting surface, a head slider provided with a head and mounted on the mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes information read from and/or written to the recording medium via the head,
said integrated circuit chip being covered by a layer 2μ m or thinner,
a height of the integrated circuit chip, including the layer, being lower than a height of the head slider from the mounting surface,
wherein said layer covers at least peripheral side portions of the integrated circuit chip.
11. A head assembly comprising:
a mounting surface;
an integrated circuit chip which is mounted so as to be raised above the mounting surface and processes signals; and
a head slider provided with a head,
said integrated circuit chip being covered at least on corner portions and bumps mounting the integrated circuit chip raised above the mounting surface by a layer of poly(p-xylylene) 2 μm or thinner,
wherein a height of the integrated circuit chip, including the layer, being lower than a height of the head slider from the mounting surface and the layer of poly(p-xylylene) prevents foreign particles from separating from the integrated circuit chip and interfering with the head assembly.
12. A disk unit for reading information from and writing information to a disk, comprising:
a head assembly having a mounting surface, a head slider provided with a head, and an integrated circuit chip which is mounted so as to be raised above the mounting surface and processes information read from and/or written to the disk via the head,
said integrated circuit chip being covered at least on corner portions and bumps mounting the integrated circuit chip raised above the mounting surface by a layer of poly(p-xylylene)2 μm or thinner,
wherein a height of the integrated circuit chip, including the layer, being lower than a height of the head slider from the mounting surface and the layer of poly(p-xylylene) prevents foreign particles from separating from the integrated circuit chip and interfering with the head assembly thereby preventing a crash of the disk unit.