Electric component with an integrated circuit mounted on an island of a lead frame
View Patent ↗The invention relates to an electronic component having an integrated circuit being packaged in a housing. The electronic component is adhesively bonded to an island of a leadframe, the island being designed to accommodate the integrated circuit and being dimensionally adapted to the base surface of the integrated circuit in order to minimize and prevent housing deformations.
1. An electronic component, comprising:
a thin quad flat package including:
a housing made of a casting or a molding compound;
an integrated circuit having a base area; and
a lead frame having an island with a base area supporting said integrated circuit, the integrated circuit being adhesively bonded such that the adhesive emerges from the base area of the island along at least one edge of the island a ratio between the base area of said integrated circuit and the base area of said island being from 0.7 to 0.9 for avoiding flexure of said housing;
said integrated circuit and said island embedded in said housing so that a thickness of a housing region above said integrated circuit is substantially equal to a thickness of a housing region below said island.
2. The electronic component according to claim 1 , including an adhesive bonding said integrated circuit to said island, and a hollow groove formed on said integrated circuit by an amount of adhesive that has emerged from between said integrated circuit and said island.
3. The electronic component according to claim 1 , wherein the base area of said island is a continuous, unpatterned area.
4. The electronic component according to claim 1 , wherein said lead frame includes leads that are routed to said island.
5. The electronic component according to claim 1 , wherein said lead frame includes leads that are vertically centered within said housing, and said island is vertically lowered with respect to said leads.