IP Library Granted Patent US 6,945,315
Granted Patent B1
US 6,945,315 · App. 09/703,282 · Granted Sep 20, 2005

Heatsink with active liquid base

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Quick Facts
Patent No.
US 6,945,315
App. No.
09/703,282
Granted
Sep 20, 2005
Kind
B1
Abstract

A device for the transfer of heat away from a heat source comprising a base having first and second surfaces a plurality of fins extending adjacent to the second surface of the base. The base further including a chamber disposed between the first surface and the second surface of the base. The chamber further including a divider disposed therein adjacent the first surface. A pump is also disposed within the chamber to circulate fluid within the chamber.

Claims (27)

1. A device for the transfer of heat away from a heat source comprising:

a base having first and second surfaces, said first surface being configured to be attached to a surface of said heat source;

a plurality of fins extending from said second surface of said base, said plurality of fins being integrated with said second surface;

a chamber disposed between said first surface and said second surface of said base;

a divider disposed between said first surface and said second surface within said chamber;

a cooling fluid disposed within said chamber;

a pump proximate an edge of said base, said pump having a power cord connected to a power source, said pump being configured to circulate said cooling fluid within said chamber;

an inlet of said pump being proximate said first surface of said base to receive said cooling fluid in said chamber that is proximate said first surface;

an outlet of said pump that pumps said cooling fluid over a first surface of said divider; and

a plurality of flow dividers disposed upon a proximal surface of said divider, said plurality of flow dividers radiating outward from said outlet of said pump and passages between said flow dividers that carry fluid being narrower at said outlet of said pump.

2. The device according to claim 1 characterized in that said pump is disposed within said chamber.

3. The device according to claim 1 wherein said cooling fluid is chosen from the group consisting of alcohol, antifreeze, propylene glycol, water.

4. The device according to claim 1 wherein said base and said fins are constructed of one of the following materials chosen from the group consisting of copper, aluminum, steel, plastic.

5. The device according to claim 1 further including a fan attached to said fins.

6. A device for transferring heat away from a heat source, comprising:

a base having first and second surfaces, the first surface being configured to be attached to a surface of the heat source;

at least one fin extending from the second surface, the at least one fin being integrated with the second surface;

a chamber disposed between the first and second surfaces of the base;

a divider disposed between the first and second surfaces within the chamber;

a pump proximate to an edge of the base, the pump being configured to circulate a cooling fluid within the chamber; and

a plurality of flow dividers disposed upon a proximal surface of the divider, the plurality of flow dividers radiating outward from an outlet of the pump and passages between the flow dividers being narrower at the outlet of the pump relative to the edge of the base.

7. The device of claim 6 , further comprising:

an inlet of the pump proximate to the first surface, the inlet being configured to receive the cooling fluid within the chamber; and

the outlet of the pump proximate to the second surface, the outlet being configured to pump the cooling fluid over the second surface.

8. The device of claim 6 , wherein the cooling fluid is contained within the chamber.

9. The device of claim 6 , further comprising:

a fan attached to the at least one fin.

Assignments (1)
MERGER AND CHANGE OF NAME Recorded Dec 14, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037280/0132 →