IP Library Granted Patent US 7,223,516
Granted Patent B2
US 7,223,516 · App. 09/729,953 · Granted May 29, 2007

Positive type photoresist composition

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Quick Facts
Patent No.
US 7,223,516
App. No.
09/729,953
Granted
May 29, 2007
Kind
B2
Abstract

A positive type photoresist composition suitable for light in the wavelength region of 170 nm to 220 nm, high in sensitivity, excellent in adhesion and giving a good resist pattern profile, which comprises a resin having an ester group represented by the following general formula [I] in its molecule and a compound generating an acid by irradiation of an active light ray or radiation: wherein R 1 represents a hydrogen atom, an alkyl group or a cycloalkyl group; and R 2 and R 3 , which may be the same or different, each represents a hydrogen atom, an alkyl group, a cycloalkyl group or -A-R 4 , and R 2 and R 3 may combine together to form a ring, wherein R 4 represents a hydrogen atom, an alkyl group or a cycloalkyl group, R 4 and R 2 or R 3 may combine together to form a ring, and A represents an oxygen atom or a sulfur atom.

Claims (5)

1. A positive photoresist composition comprising a resin which has an ester group represented by the following general formula (I-2) in its molecule and is decomposed by action of an acid to increase solubility of the resin in an alkali solution, and a compound generating an acid by irradiation of an active light ray or radiation:

wherein R 21 to R 24 , which may be the same or different, each represents a hydrogen atom or an alkyl group; and m represents 1 or 2;

wherein said resin further contains (1) repeating structure units each having an alicyclic hydrocarbon moiety and further contains (2) repeating structure units each having a group which is decomposed by action of an acid to increase solubility of the resin in an alkali developing solution.

2. The positive photoresist composition according to claim 1 , wherein said resin is a resin which contains repeating structure units corresponding to a monomer represented by the following general formula (II-2) and is decomposed by action of an acid to increase solubility of the resin in an alkali solution:

wherein R 21 to R 24 and m have the same meanings as given in claim 1 ; R 25 represents a hydrogen atom or a methyl group; and A 21 represents one group selected from the group consisting of a single bond, an alkylene group, a substituted alkylene group, an ether group, a thioether group, a carbonyl group, an ester group, an amido group, a sulfonamide group, a urethane group and a urea group, or a combination of two or more of them.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2007
From: FUJIFILM HOLDINGS CORPORATION (FORMERLY FUJI PHOTO FILM CO., LTD.)
To: FUJIFILM CORPORATION
Reel/Frame 018904/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2002
From: SATO, KENICHIRO; AOAI, TOSHIAKI
To: FUJI PHOTO FILM CO., LTD.
Reel/Frame 012584/0963 →