Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate
View Patent ↗Paste comprising metallic organic compound, in particular, gold-based metallic organic compound is used as a conductive material for repairing open defects in a metal pattern. After applying the paste, the paste is baked to deposit a metal film. This can produce a very thin metallic film having low electric resistance. Further, a semiconductor laser is used as a heating unit to heat only the paste applied to the open defect. A heating profile having a multi-step baking process includes a provisional baking and main baking process followed by a cooling process to produce a high-quality thin metallic film having no cracks and a dense texture.
1. A method for repairing a metallic pattern on a substrate, said method comprising steps of:
applying a metallic organic compound to a defect in a metallic pattern overlying said substrate; and
subjecting said metallic organic compound to a provisional and a main baking process using a laser to deposit a metallic thin film in said defect,
wherein said provisional baking process comprises increasing an output of said laser from about 0 to a first predetermined value, and holding said output at said first predetermined value for a predetermined time, whereby solvent contained in said metallic organic compound is dissipated, and
wherein said main baking process comprises increasing said output of said laser to a second predetermined value and holding said output at said second predetermined value for a predetermined time, whereby metallic components are deposited.
2. A method for repairing a metallic pattern on a substrate according to claim 1 , wherein said laser comprises a semiconductor laser, and wherein infrared energy from a said semiconductor laser is used as a heat source for baking said metallic organic compound.
3. A method for repairing a metallic pattern on a substrate according to claim 2 , and wherein said method further comprises cooling said substrate after baking said metallic organic compound.
4. A method for repairing a metallic pattern on a substrate according to claim 1 , further comprising a step of removing a protruding portion of a deposited metallic thin film from said metallic pattern.
5. A method for repairing a metallic pattern on a substrate according to claim 2 , further comprising a step of removing a portion of a deposited metallic thin film protruding from said metallic pattern.
6. A method for repairing a metallic pattern on a substrate according to claim 3 , further comprising a step of removing a portion of a deposited metallic thin film protruding from said metallic pattern.
7. A method for repairing a metallic pattern on a substrate according to claim 1 , wherein holding said output at said first predetermined value for a predetermined time comprises holding said output for about 24 seconds.
8. A method for repairing a metallic pattern on a substrate according to claim 7 , wherein said provisional baking process further comprises increasing said output of said laser from about 0 to an intermediate value and holding said output at said intermediate value for a predetermined time, wherein said intermediate value is less than said first predetermined value.
9. A method for repairing a metallic pattern on a substrate according to claim 8 , wherein holding said output at said intermediate value for a predetermined time comprises holding said output for about 16 seconds.
10. A method for repairing a metallic pattern on a substrate according to claim 1 , wherein said metallic thin film has a portion that protrudes from said metallic pattern, said method further comprising applying a laser to trim away said portion from said metallic pattern.
11. A method for repairing a metallic pattern on a substrate according to claim 10 , wherein applying a laser comprises applying a YAG laser.
12. A method for repairing a metallic pattern on a substrate according to claim 10 , wherein said substrate comprises is a glass mask.
13. A method for repairing a metallic pattern on a substrate, said method comprising steps of:
providing a transfer probe and a paste plate;
pressing said transfer probe into said paste plate and transferring a predetermined amount of metal-organic compound from said paste plate to said transfer probe;
moving said transfer probe to said substrate and transferring said predetermined amount of said metallic organic compound to a defect in a metallic pattern overlying said substrate;
subjecting said metal-organic compound to a provisional and a main baking process using a laser to deposit a metallic thin film in said defect,
wherein said provisional baking process comprises increasing an output of said laser from about 0 to a first predetermined value, and holding said output at said first predetermined value for a predetermined time, whereby solvent contained in said organic compound is dissipated, and
wherein said main baking process comprises increasing said output of said laser to a second predetermined value and holding said output at said second predetermined value for a predetermined time, whereby metallic components are deposited.
14. A method for repairing a metallic pattern on a substrate according to claim 13 , wherein providing a paste plate comprises:
providing a plate frame;
pouring said metallic organic compound into said plate frame; and
leveling off said metallic organic compound in said plate frame by applying a squeegee to said metallic organic compound.
15. A method for repairing a metallic pattern on a substrate according to claim 13 , wherein providing a transfer probe comprises providing a beryllium copper probe having flattened tip end.
16. A method for repairing a metallic pattern on a substrate according to claim 13 , further comprising locating defects in said metallic pattern, wherein said locating comprises the steps of:
providing an inspection probe and an inspection brush interconnected to an inspection circuit;
contacting a selected metallic line in said metallic pattern with said inspection probe and said inspection brush; and
sliding said inspection brush toward said inspection probe along said metallic line while monitoring a voltage in said inspection circuit.