IP Library › Granted Patent US 6,583,391
Granted Patent Utility
US 6,583,391 · Confirmation No. 8520

MODULATION METHOD AND APPARATUS FOR THERMALLY ANALYZING A MATERIAL

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2011-03-03 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2001-03-23 SPEC Specification 15 View
2001-01-31 TRNA Transmittal of New Application 1 View
2001-01-31 A.PE Preliminary Amendment 3 View
2001-01-31 SPEC Specification 15 View
2001-01-31 CLM Claims 5 View
2001-01-31 ABST Abstract 1 View
2001-01-31 DRW Drawings-only black and white line drawings 4 View
2001-01-31 OATH Oath or Declaration filed 4 View
2001-01-31 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,583,391
App. No.
09/773,783
Filed
2001-01-31
Granted
2003-06-24
Pub. No.
US20010019049A1
Art Unit
3742
PTA
0 days