IP Library Granted Patent US 6,420,517
Granted Patent Utility
US 6,420,517 · Confirmation No. 3233

PROCESS FOR RESIN PHASE SEPARATION BY PLATE DECANTATION

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Code Description Pages PDF
2018-08-23 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2014-03-17 OATH Oath or Declaration filed 135 View
2001-02-06 TRNA Transmittal of New Application 2 View
2001-02-06 SPEC Specification 13 View
2001-02-06 CLM Claims 5 View
2001-02-06 ABST Abstract 1 View
2001-02-06 DRW Drawings-only black and white line drawings 4 View
2001-02-06 OATH Oath or Declaration filed 15 View
2001-02-06 TRNA Transmittal of New Application 2 View
2001-02-06 SPEC Specification 13 View
2001-02-06 CLM Claims 5 View
2001-02-06 ABST Abstract 1 View
2001-02-06 DRW Drawings-only black and white line drawings 4 View
2001-02-06 OATH Oath or Declaration filed 15 View
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Quick Facts
Patent No.
US 6,420,517
App. No.
09/778,157
Filed
2001-02-06
Granted
2002-07-16
Art Unit
1714
PTA
-64 days