Semiconductor device provided with rewiring layer
View Patent ↗In a small semiconductor device having external terminals on a semiconductor element and a semiconductor module mounted with the small semiconductor device, disconnection of the external terminals is prevented when a temperature change occurs under the conditions that the semiconductor device is mounted on a printed circuit board. To achieve this a projection is formed on a land which is an external terminal bonding area of the semiconductor device, and a protruded portion of the projection is bonded to the external terminal. An intervening portion of a protective film made of resin material is formed between the lands and semiconductor element.
1. A semiconductor device comprising:
a semiconductor substrate formed with pads;
a passivation film formed on a surface of said semiconductor substrate on a pad forming side; and
lands for connection to external terminals, said lands being formed on an insulating film formed on a surface of said passivation film opposite to said semiconductor substrate;
wherein:
said pads and said lands are connected by conductive wiring lines;
said external terminals are solder bumps and said lands are formed of a material comprising Cu; and
projections, made of a material comprising Cu, are formed on each of said lands at positions where said lands are connected to the external terminals.
2. A semiconductor device comprising:
a silicon substrate formed with pads;
a passivation film formed on a surface of said silicon substrate on a pad forming side;
lands for connection to external terminals which are solder bumps, said lands being made of a material comprised of Cu and formed on the surface of said silicon substrate on the pad forming side, respectively; and
wiring lines connecting said pads and said lands;
wherein:
an insulating film is formed between said passivation film and said lands;
projections, made of a material comprising Cu, are formed on said lands on a surface opposite to said silicon substrate; and
said projections are connected to the external terminals, respectively.
3. A semiconductor device comprising:
a semiconductor substrate formed with pads;
a passivation film formed on a surface of said semiconductor substrate on a pad forming side;
lands for connection to external terminals, said lands being formed on the surface of said semiconductor substrate on the pad forming side;
wherein said external terminals are solder bumps and said lands are formed of a material comprising Cu;
the external terminals being connected to said lands;
wherein said projections, made of a material comprising Cu, are formed on said lands at positions where said lands are connected to the external terminals, respectively; and
wiring lines connecting said pads and said lands;
wherein an insulating protective film is formed on the surface of said semiconductor substrate on the pad forming side in an area other than the external terminals.
4. A semiconductor device according to any one of claims 1 , 2 , or 3 , wherein in a semiconductor module having the semiconductor device mounted on a printed circuit board via the external terminals, a bonding area between a bonding pad of the printed circuit board and one of the external terminals is set larger than a bonding area between one of the projections and said one of the external terminals in a direction of disposing the external terminals.
5. A semiconductor device according to any one of claims 1 , 2 , or 3 , to wherein in a semiconductor module having the semiconductor device mounted on a printed circuit board via the external terminals, an area near a bonding area between a bonding pad of the printed circuit board and one of the external terminals is covered with resin.
6. A semiconductor device according to claim 1 or 2 , wherein said projections each include a first portion which extends into a corresponding one of said external terminals and a second portions located between a corresponding one of said lands and said first portion.
7. A semiconductor device according to claim 6 , wherein each of said first portions of said projections has substantially the same width as a corresponding one of said second portions of said projections.
8. A semiconductor device according to claim 1 , wherein the projections are positioned in projected areas of said lands.
9. A semiconductor device according to claim 2 , wherein the projections are positioned in projected areas of said lands.
10. A semiconductor device according to claim 1 , wherein the external terminals and the projections are respectively each bonded via a metal thin film formed on a surface of the projection.
11. A semiconductor device according to claim 2 , wherein the external terminals and the projections are respectively each bonded via a metal thin film formed on a surface of the projection.
12. A semiconductor device according to claim 1 ,
wherein a protective film having an opening in a region in which said land is disposed is formed on said conductive wiring and a portion of said projection is projected from a surface of said protective film.