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App. No. 09/808,522 · Confirmation No. 6596

Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2001-03-14 TRNA Transmittal of New Application 3 View
2001-03-14 A.PE Preliminary Amendment 5 View
2001-03-14 SPEC Specification 10 View
2001-03-14 CLM Claims 4 View
2001-03-14 ABST Abstract 1 View
2001-03-14 DRW Drawings-only black and white line drawings 3 View
2001-03-14 OATH Oath or Declaration filed 3 View
2001-03-14 TRNA Transmittal of New Application 3 View
2001-03-14 A.PE Preliminary Amendment 5 View
2001-03-14 SPEC Specification 10 View
2001-03-14 CLM Claims 4 View
2001-03-14 ABST Abstract 1 View
2001-03-14 DRW Drawings-only black and white line drawings 3 View
2001-03-14 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
09/808,522
Filed
2001-03-14
Pub. No.
US20020130417A1
Examiner
VU, HUNG K
Art Unit
2811