IP Library Granted Patent US 7,051,802
Granted Patent B2
US 7,051,802 · App. 09/814,495 · Granted May 30, 2006

Method and apparatus for cooling electronic enclosures

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Quick Facts
Patent No.
US 7,051,802
App. No.
09/814,495
Granted
May 30, 2006
Kind
B2
Abstract

A cooling apparatus and method, and more particularly, an apparatus and method for cooling the air exiting an electronics enclosure, are disclosed. Air is taken into the enclosure and heated by the electronic equipment. The air is then expelled through a heat exchanger, which cools the exiting air. The exiting air is cooled using an external source of cooling liquid, which absorbs the heat from the exiting air. This absorbed heat is then expelled from the liquid outside of the environment containing the enclosure. Cooling the air exiting the enclosure causes the enclosure to present a neutral heat load to a room containing such an enclosure. Cooling the exiting air obviates the necessity of increasing the room air conditioning capacity to account for the heat added to the room by the electronics within the enclosure. Further, the disclosed apparatus and method decrease the possibility of moisture condensation within the enclosure and also provide more efficient cooling than is available from prior art devices and techniques.

Claims (33)

1. A cooling system for an enclosure containing heat-producing equipment, said enclosure having an inlet allowing air from an environment containing the enclosure to enter the enclosure, the air from the environment being at a first temperature level and having a saturation temperature, the inlet being situated relative to the equipment such that the air passing therethrough to absorb heat from the equipment is increased to a second temperature level and thereafter exits the system through an outlet, the cooling enclosure comprising:

a temperature sensor for measuring the temperature of the air exiting the enclosure;

a controller operably connected to the temperature sensor;

an external cooling source;

an air-to-liquid heat exchanger positioned and adapted to remove the heat from the air exiting the enclosure, wherein the heat exchanger expels the heat to the external cooling source;

the controller controlling liquid fluid flowing through the heat exchanger in response to the measured temperature to maintain the temperature of the air exiting the heat exchanger above the saturation temperature, thus preventing condensation.

2. The cooling system of claim 1 , wherein the heat exchanger further comprises an air vent, whereby air present in the heat exchanger is expelled when the heat exchanger is charged with liquid.

3. The cooling system of claim 1 , further comprising a fan situated to move air through the heat exchanger.

4. The cooling system of claim 3 , wherein the fan is selected from the group consisting of a centrifugal blower, a cross-flow blower, an axial fan and a plug fan.

5. The cooling system of claim 3 , wherein the heat exchanger and the fan are attachable to the enclosure.

6. The cooling system of claim 1 , further comprising a valve regulating liquid flow through the heat exchanger.

7. The cooling system of claim 6 , wherein the controller modulates the valve in response to the measured temperature of the air exiting the enclosure.

8. The cooling system of claim 7 , wherein the heat exchanger cools the temperature of the air exiting the enclosure to equal the ambient temperature of the air in the environment containing the enclosure.

9. A cooling system for an enclosure containing heat-producing equipment, said enclosure having air passing therethrough to absorb heat from the equipment and thereafter exiting the system, the cooling system comprising:

an external cooling source;

an air-to-liquid heat exchanger positioned and adapted to remove the heat from the air exiting the enclosure, wherein the heat exchanger expels the heat to the external cooling source;

a valve regulating liquid flow through the heat exchanger;

a temperature sensor for sensing a temperature of air exiting the heat exchanger; and

a temperature controller coupled to the sensor for modulating the valve in response to the sensed temperature of the air exiting the heat exchanger.

10. An enclosure containing heat-producing equipment, comprising:

an air inlet for admitting air from an environment containing the enclosure, wherein the air absorbs heat from the equipment;

an air outlet for expelling the heated air from the enclosure;

an external cooling source;

an air-to-liquid heat exchanger adjacent to the air outlet, the heat exchanger absorbing heat from the heated air exiting the enclosure and expelling the heat to the external cooling source using a cooling liquid as a heat transfer medium;

a modulating valve for regulating the cooling liquid flow through the heat exchanger;

a temperature sensor sensing the temperature of the air exiting the heat exchanger; and

a temperature controller modulating the valve in response to the sensed temperature of the air exiting the heat exchanger.

11. A method for cooling an enclosure containing heat-generating equipment, the method comprising:

drawing air into the enclosure from an environment containing the enclosure;

passing the air in the vicinity of the heat-generating equipment to absorb heat from the equipment;

passing the heated air through an air-to-liquid heat exchanger in which a cooling liquid absorbs heat from the heated air;

controlling the flow of the cooling liquid through the air-to-liquid heat exchanger to maintain the air returning to the environment containing the enclosure at a temperature above the saturation temperature of the air in the environment containing the enclosure; and

rejecting heat from the cooling liquid to outside of the environment containing the enclosure.

Assignments (7)
SECURITY AGREEMENT Recorded Mar 3, 2020
From: ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.; VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.
To: CITIBANK, N.A.
Reel/Frame 052076/0874 →
RELEASE OF SECURITY INTEREST Recorded Mar 2, 2020
From: JPMORGAN CHASE BANK, N.A.
To: VERTIV CORPORATION (F/K/A ALBER CORP.); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT CORPORATION); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT FREMONT, LLC); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT HUNTSVILLE, LLC); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT REDMOND CORP.); ELECTRICAL RELIABILITY SERVICES, INC.; VERTIV CORPORATION (F/K/A EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.); VERTIV CORPORATION (F/K/A LIEBERT CORPORATION)
Reel/Frame 052065/0666 →
RELEASE OF SECURITY INTEREST Recorded Mar 2, 2020
From: THE BANK OF NEW YORK MELLON TRUST COMPANY N.A.
To: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.
Reel/Frame 052071/0913 →
SECOND LIEN SECURITY AGREEMENT Recorded Jun 10, 2019
From: VERTIV IT SYSTEMS, INC.; VERTIV CORPORATION; VERTIV NORTH AMERICA, INC.; ELECTRICAL RELIABILITY SERVICES, INC.; VERTIV ENERGY SYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049415/0262 →
CHANGE OF NAME Recorded Sep 19, 2018
From: LIEBERT CORPORATION
To: VERTIV CORPORATION
Reel/Frame 047110/0573 →
SECURITY AGREEMENT Recorded Dec 2, 2016
From: ALBER CORP.; ASCO POWER TECHNOLOGIES, L.P.; AVOCENT CORPORATION; AVOCENT FREMONT, LLC; AVOCENT HUNTSVILLE, LLC; AVOCENT REDMOND CORP.; ELECTRICAL RELIABILITY SERVICES, INC.; EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.; LIEBERT CORPORATION; LIEBERT NORTH AMERICA, INC.; NORTHERN TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 040797/0615 →
SECURITY AGREEMENT Recorded Dec 1, 2016
From: ALBER CORP.; ASCO POWER TECHNOLOGIES, L.P.; AVOCENT CORPORATION; AVOCENT FREMONT, LLC; AVOCENT HUNTSVILLE, LLC; AVOCENT REDMOND CORP.; ELECTRICAL RELIABILITY SERVICES, INC.; EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.; LIEBERT CORPORATION; LIEBERT NORTH AMERICA, INC.; NORTHERN TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 040783/0148 →