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App. No. 09/816,966 · Confirmation No. 8687

Electroplating methods for fabricating microelectronic interconnects

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2001-03-23 TRNA Transmittal of New Application 2 View
2001-03-23 SPEC Specification 11 View
2001-03-23 CLM Claims 4 View
2001-03-23 ABST Abstract 1 View
2001-03-23 DRW Drawings-only black and white line drawings 3 View
2001-03-23 OATH Oath or Declaration filed 4 View
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Quick Facts
App. No.
09/816,966
Filed
2001-03-23
Pub. No.
US20020135069A1
Examiner
VU, HUNG K
Art Unit
2811