Patent Application
Utility
App. No. 09/823,507
· Confirmation No. 6554
ASSEMBLY AND METHOD FOR CONSTRUCTING A MULTI-DIE INTEGRATED CIRCUIT
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-03-30 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-03-30 | SPEC |
Specification | 17 | View | |
| 2001-03-30 | CLM |
Claims | 4 | View | |
| 2001-03-30 | ABST |
Abstract | 1 | View | |
| 2001-03-30 | DRW |
Drawings-only black and white line drawings | 9 | View | |
| 2001-03-30 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
James P. Slupe
Caldwell, ID
Timothy V. Harper
Boise, ID
Attorneys & Agents of Record
Classification
USPC
361/760
H10W90/00
H10W72/07251
H10W90/291
H10W90/753
H10W72/884
H10W72/07554
H10W72/5363
H10W72/932
H10W72/20
H10W70/682
H10W72/547
H10W90/22
H10W90/724
H10W90/754
Prosecution
- Examiner
- CHERVINSKY, BORIS LEO
- Art Unit
- 2835
- Docket No.
- 10006998-1
- Confirmation No.
- 6554
Patent Term Adjustment
-17days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2011-09-22
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-06-08
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Quick Facts
- App. No.
- 09/823,507
- Filed
- 2001-03-30
- Granted
- 2002-06-11
- Examiner
- CHERVINSKY, BORIS LEO
- Art Unit
- 2835
- PTA
- -17 days
External Links