IP Library Patent Application 09828598
Patent Application Utility
App. No. 09/828,598 · Confirmation No. 5693

POLYESTER POLYAMIDE MOLDING COMPOSITION

Abandoned -- Failure to Pay Issue Fee View Publication ↗
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Code Description Pages PDF
2014-03-17 OATH Oath or Declaration filed 135 View
2001-04-06 TRNA Transmittal of New Application 2 View
2001-04-06 SPEC Specification 18 View
2001-04-06 CLM Claims 3 View
2001-04-06 ABST Abstract 1 View
2001-04-06 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
09/828,598
Filed
2001-04-06
Pub. No.
US20020173591A1
Art Unit
1711