Granted Patent
Utility
US 6,383,060
· Confirmation No. 7056
METHOD OF POLISHING SILICON WAFER
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-04-26 | TRNA |
Transmittal of New Application | 3 | View | |
| 2001-04-26 | SPEC |
Specification | 13 | View | |
| 2001-04-26 | CLM |
Claims | 1 | View | |
| 2001-04-26 | ABST |
Abstract | 1 | View | |
| 2001-04-26 | DRW |
Drawings-only black and white line drawings | 1 | View | |
| 2001-04-26 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Nobuyuki Kawasaki
Saga-ken, JAPAN
Masanori Mori
Saga-ken, JAPAN
Attorneys & Agents of Record
Classification
USPC
451/41
H10P90/129
B24B37/044
C09G1/02
Prosecution
- Examiner
- MCDONALD, SHANTESE L
- Art Unit
- 3723
- Customer No.
- 30132
- Confirmation No.
- 7056
Foreign Priority
128529
·
2000-04-27
·
JAPAN
Publication
- Pub. No.
- US20010036799A1
- Pub. Date
- 2001-11-01
Patent Term Adjustment
0days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2002-07-05
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-04-26
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Quick Facts
- Patent No.
- US 6,383,060
- App. No.
- 09/842,016
- Filed
- 2001-04-26
- Granted
- 2002-05-07
- Pub. No.
- US20010036799A1
- Examiner
- MCDONALD, SHANTESE L
- Art Unit
- 3723
- PTA
- 0 days
External Links