IP Library Granted Patent US 6,600,220
Granted Patent Utility
US 6,600,220 · Confirmation No. 8323

POWER DISTRIBUTION IN MULTI-CHIP MODULES

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Code Description Pages PDF
2014-10-16 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2001-05-14 TRNA Transmittal of New Application 1 View
2001-05-14 SPEC Specification 16 View
2001-05-14 CLM Claims 5 View
2001-05-14 ABST Abstract 1 View
2001-05-14 DRW Drawings-only black and white line drawings 7 View
2001-05-14 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,600,220
App. No.
09/854,544
Filed
2001-05-14
Granted
2003-07-29
Pub. No.
US20020167080A1
Art Unit
2826
PTA
-44 days