Image pickup device and cover plate with conductive film layer
View Patent ↗A cover plate for covering an opening of a casing in which a solid state imaging device is disposed. The cover plate comprises a transparent cover plate member and a conductive film layer. The cover plate hermetically covers the opening of the casing and the conductive film layer covers the outermost surface of the transparent cover plate member. The transparent cover plate member is comprised of a plurality of laminated transparent plates such as lithium niobate plates for an optical low-pass filter and a plate for an infrared cut-off filter. An example of the conductive film layer is a metallic film such as Cr or Au, coated on the surface.
1. A cover plate for covering an opening of a casing in which a solid state imaging device is disposed, said cover plate comprising:
a transparent cover plate member that hermetically covers said opening, said transparent cover plate member including a first surface facing the solid state imaging device and a second surface, opposite to the first surface, facing away from the solid state imaging device; and
a conductive film layer that covers the second surface of said transparent cover plate member, said conductive film layer being the furthest layer from the solid state imaging device.
2. A cover plate according to claim 1 , wherein said conductive film layer comprises a metallic film layer.
3. A cover plate according to claim 2 , wherein said metallic film layer comprises a Cr film layer.
4. A cover plate according to claim 1 , wherein said transparent cover plate member comprises a plurality of laminated transparent plates and at least one of said transparent plates comprises an optical low-pass filter.
5. A cover plate according to claim 4 , wherein said optical low-pass filter comprises a plurality of lithium niobate plates.
6. A cover plate according to claim 1 , wherein said transparent cover plate member comprises a plurality of laminated transparent plates and at least one of said transparent plates comprises an infrared cut-off filter.
7. A cover plate according to claim 6 , wherein at least one of said transparent plates comprises an optical low-pass filter.
8. A cover plate according to claim 7 , wherein said infrared cut-off filter and said optical low-pass filter are arranged so that said infrared cut-off filter is disposed at a side closer to said solid state imaging device.
9. A cover plate according to claim 1 , wherein said transparent cover plate member comprises a plurality of laminated transparent plates and at least one of said transparent plates comprises a cover glass.
10. A cover plate according to claim 1 , wherein said transparent cover plate member comprises at least one lithium niobate plate and said conductive film layer is formed on at least one side of said lithium niobate plate.
11. A cover plate according to claim 1 , wherein said transparent cover plate member comprises at least one infrared cut-off filter and said conductive film layer is formed on at least one side of said infrared cut-off filter.
12. A cover plate according to claim 1 , wherein said transparent cover plate member comprises at least one cover glass and said conductive film layer is formed on at least one side of said cover glass.
13. An image pickup device, comprising:
a solid state imaging device;
a casing in which said solid state imaging device is disposed;
a transparent cover plate member that hermetically covers an opening of said casing, said transparent cover plate member including a first surface facing the solid state imaging device and a second surface, opposite to the first surface, facing away from the solid state imaging device; and
a conductive film layer that covers the second surface of said transparent cover plate member, said conductive film layer being the furthest layer from the solid state imaging device.