IP Library › Granted Patent US 6,764,875
Granted Patent Utility
US 6,764,875 · Confirmation No. 6290

METHOD OF AND APPARATUS FOR SEALING AN HERMETIC LID TO A SEMICONDUCTOR DIE

Inventor: James Gill Shook
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Quick Facts
Patent No.
US 6,764,875
App. No.
09/866,266
Filed
2001-05-24
Granted
2004-07-20
Pub. No.
US20010022382A1
Art Unit
2822
PTA
-6 days