IP Library › Granted Patent US 6,586,273
Granted Patent Utility
US 6,586,273 · Confirmation No. 5138

SEMICONDUCTOR DEVICE MANUFACTURING METHOD HAVING A STEP OF APPLYING A COPPER FOIL ON A SUBSTRATE AS A PART OF A WIRING CONNECTING AN ELECTRODE PAD TO A MOUNTING TERMINAL

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 Code Description Pages PDF
2001-05-30 TRNA Transmittal of New Application 3 View
2001-05-30 SPEC Specification 33 View
2001-05-30 CLM Claims 4 View
2001-05-30 ABST Abstract 1 View
2001-05-30 DRW Drawings-only black and white line drawings 13 View
2001-05-30 OATH Oath or Declaration filed 5 View
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Quick Facts
Patent No.
US 6,586,273
App. No.
09/866,660
Filed
2001-05-30
Granted
2003-07-01
Pub. No.
US20020070440A1
Examiner
HUYNH, ANDY
Art Unit
2818
PTA
0 days