IP Library › Granted Patent US 6,687,987
Granted Patent Utility
US 6,687,987 · Confirmation No. 5060

ELECTRO-FLUIDIC ASSEMBLY PROCESS FOR INTEGRATION OF ELECTRONIC DEVICES ONTO A SUBSTRATE

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2022-11-14 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2022-09-23 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2022-09-22 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2003-11-17 IFEE Issue Fee Payment (PTO-85B) 1 View
2001-08-30 TRNA Transmittal of New Application 4 View
2001-08-30 DRW Drawings-only black and white line drawings 10 View
2001-08-30 LET. Miscellaneous Incoming Letter 1 View
2001-06-06 TRNA Transmittal of New Application 2 View
2001-06-06 SPEC Specification 21 View
2001-06-06 CLM Claims 3 View
2001-06-06 ABST Abstract 1 View
2001-06-06 DRW Drawings-only black and white line drawings 6 View
2001-06-06 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,687,987
App. No.
09/875,443
Filed
2001-06-06
Granted
2004-02-10
Pub. No.
US20020005294A1
Art Unit
3729
PTA
-4 days