IP Library › Granted Patent US 7,075,183
Granted Patent B2
US 7,075,183 · App. 09/880,733 · Granted Jul 11, 2006

Electronic device

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Quick Facts
Patent No.
US 7,075,183
App. No.
09/880,733
Granted
Jul 11, 2006
Kind
B2
Abstract

Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Claims (9)

1. An electronic device comprising a semiconductor device provided with pads and a substrate provided with pads on which said semiconductor device is mounted, said pads of said semiconductor device being bonded to said pads of said substrate through junctions comprising CuSn compounds and Cu balls, said CuSn compounds resulting from a mixture of said Cu balls and an Sn-based solder subjected to a bonding operation at a temperature above the melting point temperature of said Sn-based solder but less than the melting point temperature of said Cu balls, wherein said Cu—Sn compound includes Cu 6 Sn 5 and Cu 3 Sn and said Cu 3 Sn is disposed in a region between said Cu-balls and said Cu 6 Sn 5 .

2. An electronic device according to claim 1 , wherein said Cu 6 Sn 5 has a thickness of about a few micrometers.

3. An electronic device according to claim 1 , wherein said Cu 6 Sn 5 is formed by reflowing said Cu-balls and Sn-base solder at a temperature higher than a melting point of said Sn-base solder and lower than a melting point of said Cu-balls.

4. An electronic device according to claim 3 , wherein said Sn-base solder comprises eutectic Sn—Cu solder, eutectic Sn—Cu solder to which at least one of In, Zn and Bi is added, eutectic Sn—Ag solder, eutectic Sn—Ag solder to which at least one of In, Zn and Bi is added, eutectic Sn—Ag—Cu solder, or eutectic Sn—Ag—Cu solder to which at least one of In, Zn and Bi is added.

5. An electronic device according to claim 3 , wherein said Cu-balls have a diameter greater than 5 micrometers.

6. An electronic device comprising a semiconductor device provided with pads and a substrate provided with pads on which said semiconductor device is mounted, said pads of said semiconductor device being bonded to said pads of said substrate by way of junctions, each junction including a Cu—Sn compound containing Cu 6 Sn 5 and Cu 3 Sn and Cu balls resulting from a mixture of said Cu balls and an Sn-based solder subjected to a bonding operation at a temperature above the melting point temperature of said Sn-based solder but less than the melting point temperature of said Cu balls, said Cu 3 Sn being formed at peripheries of said Cu balls.

7. An electronic device according to claim 6 , wherein said Cu—Sn compound is formed by reflowing said Cu-balls and Sn-base solder at a temperature higher than a melting point of said Sn-base solder and lower than a melting point of said Cu-balls.

8. An electronic device according to claim 7 , wherein said Sn-base solder comprises eutectic Sn—Cu solder, eutectic Sn—Cu solder to which In, Zn or Bi is added, eutectic Sn—Ag solder, eutectic Sn—Ag solder to which In, Zn or Bi is added, eutectic Sn—Ag—Cu solder or eutectic Sn—Ag—Cu solder to which In, Zn or Bi is added.

9. An electronic device according to claim 7 , wherein said Cu-balls have a diameter greater than 5 micrometers.