IP Library › Granted Patent US 6,551,851
Granted Patent Utility
US 6,551,851 · Confirmation No. 8776

PRODUCTION OF DIAPHRAGMS OVER A CAVITY BY GRINDING TO REDUCE WAFER THICKNESS

Patented Case View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-06-18 TRNA Transmittal of New Application 1 View
2001-06-18 ADS Application Data Sheet 2 View
2001-06-18 SPEC Specification 11 View
2001-06-18 CLM Claims 2 View
2001-06-18 ABST Abstract 1 View
2001-06-18 DRW Drawings-only black and white line drawings 5 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,551,851
App. No.
09/881,744
Filed
2001-06-18
Granted
2003-04-22
Pub. No.
US20020045287A1
Art Unit
2813
PTA
0 days