Integration of amorphorous silicon transmit and receive structures with GaAs or InP processed devices
View Patent ↗A device and a process for integrating light energy transmit and/or receive functions with active devices such as GaAs or InP devices or light emitting devices, such as lasers. The device and process includes forming a passivation layer on top of the active device and forming a silicon photodetector on top of the passivation layer. The photodetector may be formed utilizing a standard solar cell growth process and may be formed as a mesa on top of the active or light-emitting device, thus forming a relatively less complicated semiconductor with an integrated monitoring device.
1. A semiconductor with integrated monitoring comprising;
a first light emitting semiconductor device formed on a predetermined substrate; a passivation layer formed on top of a portion of said first light-emitting semiconductor device, wherein the remaining portion of said light-emitting semiconductor device not covered by said passivation layer from a window; and alight monitoring device formed directly on top of said window defining an interface between said light monitoring device and said window for monitoring leakage light back from said first light-emitting semiconductor device through said window.
2. The semiconductor as recited in claim 1 , wherein said first semiconductor device is an active device.
3. The semiconductor as recited in claim 1 , wherein said predetermined substrate is a GaAs substrate.
4. The semiconductor as recited in claim 1 , wherein said predetermined substrate is a InP substrate.
5. The semiconductor as recited in claim 1 , wherein said predetermined substrate is a GaN substrate.
6. The semiconductor as recited in claim 1 , wherein said first semiconductor device is a light emitting device.
7. The semiconductor as recited in claim 1 , wherein said light emitting device is a laser.
8. The semiconductor as recited in claim 7 , wherein said laser is a vertical cavity surface emitting laser (VCSEL).
9. The semiconductor as recited in claim 1 , wherein said monitoring device is a light receiving device.
10. The semiconductor as recited in claim 9 , wherein said light receiving device is a photodiode.
11. The semiconductor as recited in claim 9 , wherein said light receiving device is a photodetector.