IP Library › Granted Patent US 6,477,058
Granted Patent Utility
US 6,477,058 · Confirmation No. 7062

INTEGRATED CIRCUIT DEVICE PACKAGE INCLUDING MULTIPLE STACKED COMPONENTS

Patented Case View Patent ↗
⬇ PDF
 Code Description Pages PDF
2015-03-09 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2015-02-27 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2001-06-28 TRNA Transmittal of New Application 1 View
2001-06-28 SPEC Specification 13 View
2001-06-28 CLM Claims 7 View
2001-06-28 ABST Abstract 1 View
2001-06-28 DRW Drawings-only black and white line drawings 4 View
2001-06-28 OATH Oath or Declaration filed 2 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,477,058
App. No.
09/894,923
Filed
2001-06-28
Granted
2002-11-05
Examiner
BUI, HUNG S
Art Unit
2841
PTA
0 days