IP Library › Granted Patent US 6,548,893
Granted Patent Utility
US 6,548,893 · Confirmation No. 2720

APPARATUS AND METHOD FOR HERMETICALLY SEALING AND EMI SHIELDING INTEGRATED CIRCUITS FOR HIGH SPEED ELECTRONIC PACKAGES

Inventors: Yu Ju Chen, Hui Wu
Patented Case View Patent ↗
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 Code Description Pages PDF
2011-03-14 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2010-08-24 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2010-08-24 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2010-08-18 PA.. Power of Attorney 1 View
2010-08-18 C.AD Change of Address 2 View
2010-08-18 LET. Miscellaneous Incoming Letter 2 View
2010-08-18 N417 Electronic Filing System Acknowledgment Receipt 2 View
2007-09-20 PA.. Power of Attorney 7 View
2007-09-20 N417 Electronic Filing System Acknowledgment Receipt 2 View
2001-07-03 TRNA Transmittal of New Application 3 View
2001-07-03 SPEC Specification 7 View
2001-07-03 CLM Claims 5 View
2001-07-03 ABST Abstract 1 View
2001-07-03 DRW Drawings-only black and white line drawings 4 View
2001-07-03 OATH Oath or Declaration filed 2 View
2001-07-03 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,548,893
App. No.
09/898,567
Filed
2001-07-03
Granted
2003-04-15
Examiner
HO, TU TU V
Art Unit
2818
PTA
-128 days