Granted Patent
Utility
US 6,753,256
· Confirmation No. 4505
METHOD OF MANUFACTURING SEMICONDUCTOR WAFER
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2004-05-10 | IFEE |
Issue Fee Payment (PTO-85B) | 1 | View | |
| 2001-08-02 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-08-02 | ADS |
Application Data Sheet | 1 | View | |
| 2001-08-02 | SPEC |
Specification | 15 | View | |
| 2001-08-02 | CLM |
Claims | 3 | View | |
| 2001-08-02 | ABST |
Abstract | 1 | View | |
| 2001-08-02 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2001-08-02 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Tomohiro Hashii
Osaka, JAPAN
Tooru Watanabe
Osaka, JAPAN
Attorneys & Agents of Record
Classification
USPC
438/689
H10P90/12
B24B37/042
B24B37/08
Prosecution
- Examiner
- ANYA, IGWE U
- Art Unit
- 2825
- Customer No.
- 6858
- Docket No.
- 5532
- Confirmation No.
- 4505
Foreign Priority
2000-235146
·
2000-08-03
·
JAPAN
2001-229118
·
2001-07-30
·
JAPAN
Publication
- Pub. No.
- US20020016072A1
- Pub. Date
- 2002-02-07
Patent Term Adjustment
-140days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2004-03-17
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2002-07-05
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Quick Facts
- Patent No.
- US 6,753,256
- App. No.
- 09/919,900
- Filed
- 2001-08-02
- Granted
- 2004-06-22
- Pub. No.
- US20020016072A1
- Examiner
- ANYA, IGWE U
- Art Unit
- 2825
- PTA
- -140 days
External Links