Integrated electromagnetic shielding device
View Patent ↗To isolate at least one electric or electronic element ( 16, 58 ), for example an interconnection integrated onto a semiconductor substrate ( 12 ), this device comprises at least one isolation means chosen from an isolating layer ( 84, 86, 90 ) extending in the substrate and an assembly whose height exceeds that of the element and which comprises, on either side of the element, at least two superposed conductors ( 60 62 64, 66 68 70 ), which are integrated into the substrate and extend along the element.
1. A device for isolating at least one electric or electronic element integrated onto a semiconductor substrate, comprising:
at least one electrically insulating or semiconducting isolating layer which extends in the substrate and is laterally spaced from said element;
an assembly, which is disposed over the substrate, said assembly including, on either side of the element, at least two superposed electric conductors, which extend along the element, wherein the assembly has a height that exceeds a height of the element; and
at least one transverse trench which extends at least partly directly beneath said element and is filled with an electrically insulating material.
2. A device as claimed in claim 1 , which comprises two isolating layers, which fill two trenches extending in the substrate, perpendicularly to the surface of the substrate and along the element, on either side of this element.
3. A device as claimed in claim 2 , wherein each trench extends below the two superposed electric conductors.
4. A device as claimed in claim 1 , wherein the superposed electric conductors are electrically interconnected by at least one via formed through an electrically insulating material.
5. A device as claimed in claim 1 , which additionally comprises an electrically conducting layer which extends above the element and connects the two uppermost electric conductors to each other, said conductors being arranged on either side of the element.