Synthesis of layers, coatings or films using templates
Systems and methods are described for synthesis of films, coatings or layers using templates. A method includes locating a template within at least one of a first precursor layer that is coupled to a first substrate and a second precursor layer that is coupled to a second substrate; forming a composition layer; and moving the first substrate relative to the second substrate, wherein the composition layer remains coupled to the second substrate.
1. A method, comprising:
locating a template within at least one of a first precursor layer that is coupled to a first substrate and a second precursor layer that is coupled to a second substrate; forming a composition layer by contacting the first precursor layer and the second precursor layer; and moving the first substrate relative to the second substrate, wherein the composition layer remains coupled to the second substrate.
2. The method of claim 1 , where the first precursor layer includes a first chemical reactant, the second precursor layer includes a second chemical reactant, and the composition layer includes a chemical product yielded by a chemical reaction between the first chemical reactant and the second chemical reactant.
3. The method of claim 1 , wherein the first chemical reactant includes a first multinary compound and the second chemical reactant includes a second multinary compound.
4. The method of claim 1 , wherein an electrostatic field applied across the first precursor layer and the second precursor layer is sufficient change a transport rate of at least one ionic species.
5. The method of claim 1 , wherein the electrostatic field applied across the first precursor layer and the second precursor layer is sufficient to generate a pressure between the first precursor layer and the second precursor layer.
6. The method of claim 5 wherein the pressure is sufficient to substantially prevent escape of vapor from at least one of the first precursor layer, the second precursor layer and the composition layer.
7. The method of claim 6 , wherein the pressure is sufficient to substantially prevent escape of vapor from the first precursor layer, the second precursor layer and the composition layer.
8. The method of claim 1 , further comprising heating the first precursor layer.
9. The method of claim 8 , wherein at least a portion of the second precursor layer melts and substantially no portion of the first precursor layer melts.
10. The method of claim 1 , wherein the first substrate includes a tool.
11. The method of claim 10 , wherein a release layer is located between the tool and the first precursor layer.
12. The method of claim 11 , wherein the release layer includes at least one fluoride selected from the group consisting of CaF 2 and SrF 2 .
13. The method of claim 10 , further comprising coupling another precursor layer to the tool after moving.
14. The method of claim 1 , wherein an electrode layer is located between the second precursor layer and the second substrate.
15. The method of claim 14 , wherein the electrode layer includes at least one metal selected from the group consisting of Mo and Ti.
16. The method of claim 1 , wherein the composition layer includes copper, indium and selenium.
17. The method of claim 16 , further comprising controlling the temperature of the second precursor layer within a range of from approximately 520° C. to approximately 635° C.
18. The method of claim 16 , wherein the first precursor layer includes (In,Ga) y (S,Se) 1-y and the second precursor layer includes Cu x Se 1-x.
19. The method of claim 1 , wherein the template is located between the first precursor layer and the first substrate.
20. The method of claim 1 , wherein the template is located between the second precursor layer and the second substrate.
21. The method of claim 1 , wherein a surfactant is located between the first precursor layer and the first substrate.
22. The method of claim 1 , wherein a surfactant is located between the first precursor layer and the second precursor layer.
23. The method of claim 1 , wherein an adhesion layer is located between the first precursor layer and the first substrate.
24. The method of claim 1 , wherein an adhesion layer is located between the second precursor layer and the second substrate.
25. The method of claim 1 , wherein a diffusion barrier layer is located between the first precursor layer and the first substrate.
26. The method of claim 1 , wherein a diffusion barrier layer is located between the second precursor layer and the second substrate.
27. The method of claim 1 , wherein
the first precursor layer is coupled to the first substrate by a deposition method selected from the group consisting of physical vapor deposition and chemical vapor deposition; and
the second precursor layer is coupled to the second substrate by a deposition method selected from the group consisting of sputtering followed by plasma discharge, physical vapor deposition and chemical vapor deposition.
28. The method of claim 1 , further comprising depositing a buffer layer on the composition layer.
29. The method of claim 28 , further comprising deposition a window layer on the buffer layer.
30. A process of preparing a film formed of multinary compounds, comprising:
locating a template within at least one of a first precursor layer that is coupled to a first substrate and a second precursor layer that is coupled to a second substrate; forming the film by contacting the first precursor layer and the second precursor layer and moving the first substrate relative to the second substrate, wherein the film remains coupled to the second substrate.