Microphone for a hearing aid
View Patent ↗A microphone assembly having a housing, a transducer, and an electronic circuit. The housing has an opening, and the transducer is disposed within that opening. The electronic circuit covers the opening such that the transducer is surrounded by at least the electronic circuit and the housing. The electronic circuit includes a substrate and an amplifier for amplifying the electrical signal into an amplified electrical signal which is coupled to a connection means. The connection means provides a direct electrical connection between the electronic circuit and a receiver. The amplifier is mounted on the substrate and disposed on a side of the substrate of the electronic circuit facing the transducer. The receiver is disposed on a side opposite the side and outside the housing.
1. A microphone assembly comprising:
a housing having an opening;
a transducer, disposed within said opening of said housing, for converting sound into an electrical signal; and
an electronic circuit disposed to cover said opening such that said transducer is surrounded by at least said electronic circuit and said housing, said electronic circuit including a substrate and an amplifier for amplifying said electrical signal into an amplified electrical signal which is coupled to a connection means, said connection means providing a direct electrical connection between said electronic circuit and a receiver, said amplifier being mounted on said substrate and disposed on a side of said substrate of said electronic circuit facing said transducer, said receiver being disposed on a side opposite said side and outside said housing.
2. The microphone assembly of claim 1 , wherein said electronic circuit includes active components and passive components, said active components being disposed on said side of said substrate, said passive components being disposed on the other side of said substrate.
3. The microphone assembly of claim 1 , wherein said electronic circuit includes a hybrid that includes said substrate.
4. The microphone assembly of claim 1 , wherein said electronic circuit includes a printed circuit board that includes said substrate.
5. The microphone assembly of claim 1 , wherein said electronic circuit includes active components enclosed in a single integrated circuit, said amplifier being an active component.
6. The microphone assembly of claim 1 , wherein said electronic circuit includes a flexprint that includes said substrate.
7. The microphone assembly of claim 1 , wherein said housing and said electronic circuit shield active components of said electronic circuit from undesired electromagnetic interference.
8. The microphone assembly of claim 2 , wherein said amplifier is a differential preamplifier.
9. The microphone assembly of claim 1 , wherein said connection means includes a solder pad.
10. The microphone assembly of claim 1 , wherein said connection means includes a flexprint.
11. A microphone assembly comprising:
a housing having an inlet for receiving an acoustic signal;
a transducer, disposed in said housing, for converting said acoustic signal into an electric signal;
an electronic circuit for processing said electric signal into an audio signal that is sent by said microphone directly to a speaker that is external to said housing, said electronic circuit including at least a substrate and an amplifier mounted on said substrate, wherein said electronic circuit acts as a cover for said housing, said electronic circuit and said housing shielding active components of said electronic circuit from undesired electromagnetic interference and substantially surrounding said transducer, said amplifier being disposed on a side of said substrate of said electronic circuit facing said transducer.
12. A microphone assembly of claim 11 , wherein said electronic circuit includes a hybrid that comprises said substrate.
13. A microphone assembly of claim 11 , wherein said electronic circuit includes a printed circuit board that comprises said substrate.
14. A microphone assembly of claim 11 , wherein said electronic circuit includes a flexprint that comprises said substrate.