Patent Application
Utility
App. No. 09/963,929
· Confirmation No. 1294
Embossed carrier tape, method of manufacturing the same and the metal molds used herein
Abandoned -- Failure to Respond to an Office Action
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-09-26 | TRNA |
Transmittal of New Application | 3 | View | |
| 2001-09-26 | A.PE |
Preliminary Amendment | 11 | View | |
| 2001-09-26 | SPEC |
Specification | 24 | View | |
| 2001-09-26 | CLM |
Claims | 4 | View | |
| 2001-09-26 | ABST |
Abstract | 1 | View | |
| 2001-09-26 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2001-09-26 | OATH |
Oath or Declaration filed | 1 | View |
Inventors
Shozi Hashizume
Tokyo, JAPAN
Yukio Nomura
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
264/104
B32B3/02
B65D71/00
Y10T428/28
B32B7/04
Prosecution
- Examiner
- TENTONI, LEO B
- Art Unit
- 1732
- Customer No.
- 26339
- Docket No.
- NEM-01802
- Confirmation No.
- 1294
Foreign Priority
363725/1998
·
1998-12-22
·
JAPAN
Publication
- Pub. No.
- US20020031660A1
- Pub. Date
- 2002-03-14
from
NEC CORPORATION
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2002-11-04
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Quick Facts
- App. No.
- 09/963,929
- Filed
- 2001-09-26
- Pub. No.
- US20020031660A1
- Examiner
- TENTONI, LEO B
- Art Unit
- 1732
External Links