IP Library Granted Patent US 6,871,395
Granted Patent B2
US 6,871,395 · App. 09/965,160 · Granted Mar 29, 2005

Methods for manufacturing a tactile sensor using an electrically conductive elastomer

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Quick Facts
Patent No.
US 6,871,395
App. No.
09/965,160
Granted
Mar 29, 2005
Kind
B2
Abstract

The present invention provides methods for connecting electrically conductive elastomer to electronics that reduce cost and time for manufacturing a tactile sensor that includes an electrically conductive elastomer such as a conductive foam. The methods provide a good connection between the electrically conductive elastomer and the electrodes connected to the electronics, which provide for repeatable measurements. The methods can be used for all cases of electrically conductive elastomers and elastomers made to be conductive with the addition of conductive particles (such as carbon, silver, nickel, gold, etc.) including thermoplastic and some thermosetting elastomers.

Claims (38)

1. A method of manufacturing a tactile sensor including an electrically conductive elastomer, said method comprising the steps of:

providing a base having at least one electrode thereon;

applying a low temperature solder to a top of said electrode;

placing an electrically conductive elastomer on said base, wherein said electrically conductive elastomer is to receive a touch detectable by said tactile sensor;

heating said electrically conductive elastomer on said base to a temperature below a melting point of said electrically conductive elastomer to cause said low temperature solder to wick into said electrically conductive elastomer.

2. The method of claim 1 , further comprising the step of:

applying insulating heat resistant adhesive on at least a portion of said base where said at least one electrode is not present.

3. The method of claim 1 wherein said electrically conductive elastomer comprises a foam.

4. The method of claim 3 wherein said foam comprises a polyethylene closed cell foam.

5. The method of claim 4 wherein said melting point comprises about 100 degrees C.

6. The method of claim 3 wherein said foam comprises a polyethylene open cell foam.

7. The method of claim 3 wherein said foam comprises a polyethylene foam and said melting point comprises about 100° C.

8. The method of claim 1 wherein said low temperature solder melts at a temperature between about 70 and about 150 degrees C.

9. The method of claim 1 wherein said low temperature solder melts at between about 90 and about 130 degrees C.

10. The method of claim 1 wherein said at least one electrode comprises a metal trace on said base which comprises a printed circuit board.

11. The method of claim 1 wherein said temperature is sufficiently high to cause conduction and/or convection to heat said low temperature solder to about 5 to 20 degrees C. higher than a melting point of said low temperature solder.

12. The method of claim 1 wherein said base comprises a rigid material.

13. The method of claim 1 wherein said base comprises a curved material.

14. The method of claim 1 wherein said base comprises a flat material.

15. A method of manufacturing a tactile sensor including an electrically conductive elastomer, said method comprising the steps of:

providing an electrically conductive elastomer;

providing a layer comprising a conductive material to be at least one electrode on a top of said electrically conductive elastomer;

perforating through said layer to create a plurality of burrs protruding from said layer of said conductive material into said electrically conductive elastomer; and

melting said electrically conductive elastomer locally around said plurality of burrs to connect said at least one electrode to said electrically conductive elastomer.

16. The method of claim 15 wherein said electrically conductive elastomer comprises a foam.

17. The method of claim 16 wherein said foam comprises a polyethylene foam.

18. The method of claim 15 wherein said layer comprises a strip of zinc-coated copper.

19. The method of claim 15 wherein said layer comprises a strip of conductive material rolled from a spool.

20. The method of claim 15 wherein said perforating step is performed by a punch.

21. The method of claim 20 wherein said perforating step is also performed with a concentrating plate.

22. The method of claim 15 wherein said perforating step is performed by a wheel having at least one punch element thereon.

23. The method of claim 22 wherein said at least one punch element comprises a tooth-like element.

24. The method of claim 22 wherein said at least one punch element comprises a block type element.

25. The method of claim 22 wherein said wheel has various sizes of punch elements thereon.

26. The method of claim 22 wherein said wheel has various types of punch elements thereon.

27. The method of claim 22 wherein said perforating step also perforates entirely through said electrically conductive elastomer.

28. The method of claim 22 wherein said at least one punch element comprises a cylindrical element.

29. The method of claim 15 wherein said perforating step and said melting step are performed by a heated roller having at least one punch element thereon.

Assignments (3)
MERGER Recorded Sep 2, 2010
From: SIEMENS CORPORATE RESEARCH, INC.
To: SIEMENS CORPORATION
Reel/Frame 024927/0132 →
MERGER Recorded Aug 30, 2010
From: SIEMENS TECHNOLOGY-TO-BUSINESS CENTER LLC
To: SIEMENS CORPORATE RESEARCH, INC.
Reel/Frame 024906/0110 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 16, 2002
From: SCHER, IRVING S.; BENSON, DANIEL CONRAD
To: SIEMENS TECHNOLOGY-TO-BUSINESS CENTER LLC
Reel/Frame 012493/0737 →