Granted Patent
Utility
US 6,469,380
· Confirmation No. 3628
RESIN SEALED SEMICONDUTOR DEVICE UTILIZING A CLAD MATERIAL HEAT SINK
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-11-02 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-11-02 | A.PE |
Preliminary Amendment | 3 | View | |
| 2001-11-02 | SPEC |
Specification | 18 | View | |
| 2001-11-02 | CLM |
Claims | 3 | View | |
| 2001-11-02 | ABST |
Abstract | 1 | View | |
| 2001-11-02 | DRW |
Drawings-only black and white line drawings | 7 | View | |
| 2001-11-02 | OATH |
Oath or Declaration filed | 3 | View | |
| 2001-11-02 | LET. |
Miscellaneous Incoming Letter | 1 | View |
Inventors
Kazuaki Sorimachi
Saitama-shi, JAPAN
Masayoshi Kikuchi
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
257/706
H10W40/778
H10W74/10
H10W72/551
H10W72/951
H10W72/075
H10W74/00
H10W90/754
Prosecution
- Examiner
- CHAMBLISS, ALONZO
- Art Unit
- 2827
- Customer No.
- 32628
- Docket No.
- K-2018
- Confirmation No.
- 3628
Foreign Priority
2000-340055
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2000-11-08
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JAPAN
Publication
- Pub. No.
- US20020084523A1
- Pub. Date
- 2002-07-04
Patent Term Adjustment
-72days
No related applications found.
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Quick Facts
- Patent No.
- US 6,469,380
- App. No.
- 09/985,391
- Filed
- 2001-11-02
- Granted
- 2002-10-22
- Pub. No.
- US20020084523A1
- Examiner
- CHAMBLISS, ALONZO
- Art Unit
- 2827
- PTA
- -72 days
External Links