IP Library Granted Patent US 6,912,330
Granted Patent B2
US 6,912,330 · App. 09/991,542 · Granted Jun 28, 2005

Integrated optical/electronic circuits and associated methods of simultaneous generation thereof

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Quick Facts
Patent No.
US 6,912,330
App. No.
09/991,542
Granted
Jun 28, 2005
Kind
B2
Abstract

A method for forming a hybrid active electronic and optical circuit using a lithography mask. The hybrid active electronic and optical circuit comprising an active electronic device and at least one optical device on a Silicon-On-Insulator (SOI) wafer. The SOI wafer including an insulator layer and an upper silicon layer. The upper silicon layer including at least one component of the active electronic device and at least one component of the optical device. The method comprising projecting the lithography mask onto the SOT waver in order to simultaneously pattern the component of the active electronic device and the component of the optical device on the SOI wafer.

Claims (16)

1. A method for forming a hybrid active electronic and optical circuit using a lithography mask, the hybrid active electronic and optical circuit comprising an active electronic device and at least one optical device, both devices disposed at least in part in a single Silicon-On-Insulator (SOI) wafer, the SOI wafer including an insulator layer and an upper silicon layer, the upper silicon layer including at least one component of the active electronic device and at least one component of the optical device, the method comprising projecting the lithography mask onto the SOI waver in order to simultaneously pattern the component of the active electronic device and the component of the optical device on the SOI wafer.

2. The method of claim 1 , wherein altering an electric voltage level applied to the active electronic device effects the free carrier distribution in a region of the optical device, and thereby changes the effective mode index of the region of the optical device.

3. The method of claim 1 , wherein the optical device is an active optical device includes an active optical device.

4. The method of claim 1 , wherein the optical device is includes a passive optical device.

5. The method of claim 1 , wherein the optical device is a focusing mirror.

6. The method of claim 1 , wherein the optical device is an input/output coupler that couples light into a waveguide.

7. The method of claim 1 , wherein the optical device is a Fabry-Perot cavity.

8. The method of claim 1 , wherein the optical device is a wavelength division multiplexer modulator.

9. The method of claim 1 , wherein the optical device is an evanescent coupler.

10. The method of claim 1 , wherein the optical device is a diode.

11. The method of claim 1 , wherein the optical device is a transistor.

12. The method of claim 1 , further comprising etching portions of the hybrid active electronic and optical circuit from a surface of the SOI wafer utilizing the lithography mask.

13. The method of claim 1 , further comprising depositing materials on portions of the hybrid active electronic and optical circuit to form a surface of the SOI wafer utilizing the lithography mask.

14. The method of claim 1 , wherein the optical device includes one from the group of a p-n device, a field plated device, a Schottky device, a MOSCAP, and a MOSFET.

15. A method for forming a hybrid active electronic and optical circuit using a lithography mask, the hybrid active electronic and optical circuit comprising an active electronic device and at least one optical device, both devices disposed at least in part in a single wafer, the wafer including an insulator layer and an upper silicon layer, the upper silicon layer including at least one component of the active electronic device and at least one component of the optical device, the method comprising projecting the lithography mask onto the wafer in order to simultaneously pattern the component of the active electronic device and the component of the optical device on the wafer.

16. The method of claim 15 , wherein the wafer is a silicon-on-sapphire wafer.

Assignments (7)
CHANGE OF NAME Recorded Nov 8, 2012
From: LIGHTWIRE, INC.
To: LIGHTWIRE LLC
Reel/Frame 029275/0040 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2012
From: LIGHTWIRE LLC
To: CISCO TECHNOLOGY, INC.
Reel/Frame 029275/0050 →
RELEASE OF SECURITY INTEREST Recorded Apr 20, 2012
From: CISCO SYSTEMS, INC.
To: LIGHTWIRE, INC.
Reel/Frame 028078/0927 →
SECURITY AGREEMENT Recorded Mar 6, 2012
From: LIGHTWIRE, INC.
To: CISCO SYSTEMS, INC.
Reel/Frame 027812/0631 →
CHANGE OF NAME Recorded Feb 17, 2012
From: SIOPTICAL, INC.
To: LIGHTWIRE, INC.
Reel/Frame 027727/0326 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2003
From: OPTRONX, INC.
To: SIOPTICAL, INC
Reel/Frame 014567/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2002
From: DELIWALA, SHRENIK
To: OPTRONX, INC.
Reel/Frame 012624/0171 →