IP Library Granted Patent US 6,514,878
Granted Patent Utility
US 6,514,878 · Confirmation No. 5062

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING A MULTILAYERED INTERCONNECTION STRUCTURE

Inventor: Hirofumi Watatani
⬇ PDF
Code Description Pages PDF
2001-12-03 TRNA Transmittal of New Application 4 View
2001-12-03 A.PE Preliminary Amendment 11 View
2001-12-03 SPEC Specification 17 View
2001-12-03 CLM Claims 5 View
2001-12-03 ABST Abstract 1 View
2001-12-03 DRW Drawings-only black and white line drawings 12 View
2001-12-03 OATH Oath or Declaration filed 5 View
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Quick Facts
Patent No.
US 6,514,878
App. No.
09/998,236
Filed
2001-12-03
Granted
2003-02-04
Pub. No.
US20020039840A1
Art Unit
2818
PTA
-151 days