IP Library › Granted Patent US 6,602,790
Granted Patent Utility
US 6,602,790 · Confirmation No. 5654

METHOD FOR PATTERNING A MULTILAYERED CONDUCTOR/SUBSTRATE STRUCTURE

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 Code Description Pages PDF
2002-07-05 TRNA Transmittal of New Application 1 View
2002-07-05 DRW Drawings-only black and white line drawings 14 View
2001-11-13 TRNA Transmittal of New Application 2 View
2001-11-13 SPEC Specification 31 View
2001-11-13 CLM Claims 9 View
2001-11-13 ABST Abstract 1 View
2001-11-13 DRW Drawings-only black and white line drawings 16 View
2001-11-13 OATH Oath or Declaration filed 2 View
2001-11-13 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,602,790
App. No.
10/008,808
Filed
2001-11-13
Granted
2003-08-05
Pub. No.
US20030092267A1
Art Unit
2812
PTA
-90 days