Mask identification database server
The physical movement of reticles and solder bump masks within a wafer processing plant are continually tracked and documented in a historical database for the useful life of the reticles or masks. In an example embodiment of the mask tracking method, the method includes moving the masks from one location to another in mask pods. In addition, a mask data set is generated for each mask composed of a mask identification code cross-referenced to a pod identification code and the mask data sets are processed by a computer arrangement. The mask data sets are then updated in the computer arrangement to include a facility location identification code as each mask moves to a subsequent location during wafer processing. The present invention provides the advantage that wafer lots and reticles can be matched to an event on the processing line and stored as data for later review and analysis.
1. A computer-based automated method for tracking the movement of masks used in a wafer processing facility, the masks being moved in mask pods, the method comprising:
for each mask, generating mask data that includes a mask identification code;
using a computer to process the mask data, including cross-referencing respective mask identification codes to pod identification codes, and updating the mask data to include a facility location identification code;
conducting a degradation analysis on each mask that includes a comparison of the mask data to a mask baseline specification so as to generate degradation data for each mask; and
analyzing and tracking the mask degradation data to determine the useful life of each mask.
2. The method of claim 1 , further including tracking an event associated with a select wafer lot, the event tracking including matching the mask identification code with the select wafer lot.
3. The method of claim 1 , further including continuously updating the mask data to reflect a new location identification code in response to the mask being routed to a new location.
4. The method of claim 1 , wherein conducting a degradation analysis on each mask includes comparing the mask data to desired mask attributes.
5. The method of claim 1 , further including modeling the mask degradation.
6. The method of claim 1 , wherein determining the useful life of each mask includes comparing the mask data with a predefined level of mask degradation.
7. The method of claim 1 , wherein the useful life of each mask is determined as the mask's movement is tracked.
8. The method of claim 7 , wherein the determined useful life of each mask is updated as the mask moves throughout the wafer processing facility.
9. The method of claim 1 , wherein the degradation data includes data corresponding to the effects of cleaning the mask.
10. The method of claim 1 , wherein the degradation data includes data corresponding to the effects of handling the mask.
11. The method of claim 1 , wherein the degradation data includes data corresponding to the effects of particle contamination of the mask.