Selective etchant for oxide sacrificial material in semiconductor device fabrication
View Patent ↗An etching composition and method is disclosed for removing an oxide sacrificial material during manufacture of semiconductor devices including micromechanical, microelectromechanical or microfluidic devices. The etching composition and method are based on the combination of hydrofluoric acid (HF) and sulfuric acid (H 2 SO 4 ). These acids can be used in the ratio of 1:3 to 3:1 HF:H 2 SO 4 to remove all or part of the oxide sacrificial material while providing a high etch selectivity for non-oxide materials including polysilicon, silicon nitride and metals comprising aluminum. Both the HF and H 2 SO 4 can be provided as “semiconductor grade” acids in concentrations of generally 40-50% by weight HF, and at least 90% by weight H 2 SO 4 .
1. A method for manufacturing a semiconductor device using a plurality of deposited and patterned layers of polysilicon, an oxide sacrificial material, and an exposed metal layer including aluminum comprising the step of etching the oxide sacrificial material by immersing the semiconductor device into an etching solution comprising hydrofluoric acid (HF) and sulfuric acid (H 2 SO 4 ) in a ratio HF:H 2 SO 4 ranging from 1:1 to 3:1 while retaining the patterned layers of polysilicon and the exposed metal layer including aluminum.
2. The method of claim 1 wherein the etching solution has an etch selectivity for the oxide sacrificial material relative to the exposed metal layer including aluminum of greater than 100.
3. The method of claim 1 wherein the semiconductor device comprises a micromechanical device, a microelectromechanical device or a microfluidic device.
4. The method of claim 1 wherein the step of etching the oxide sacrificial material is performed with the etching solution at a temperature in the range of 5-70° C.
5. The method of claim 1 wherein the hydrofluoric acid comprises a “semiconductor grade” hydrofluoric acid, and the sulfuric acid comprises a “semiconductor grade” sulfuric acid.
6. The method of claim 1 wherein the hydrofluoric acid comprises at least 40-50% by weight HF.
7. The method of claim 1 wherein the sulfuric acid comprises at least 90% by weight H 2 SO 4 .