IP Library › Patent Application 10012081
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App. No. 10/012,081 · Confirmation No. 2852

SEMICONDUCTOR WAFER PLATING CATHODE ASSEMBLY

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2005-03-10 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2003-07-30 LET. Miscellaneous Incoming Letter 2 View
2001-11-02 TRNA Transmittal of New Application 3 View
2001-11-02 SPEC Specification 13 View
2001-11-02 CLM Claims 3 View
2001-11-02 ABST Abstract 1 View
2001-11-02 DRW Drawings-only black and white line drawings 3 View
2001-11-02 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
10/012,081
Filed
2001-11-02
Granted
2003-06-17
Pub. No.
US20030085119A1
Art Unit
1746
PTA
0 days