Granted Patent
Utility
US 6,666,369
· Confirmation No. 1112
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, ELECTRONIC PARTS MOUNTING METHOD AND HEATING/MELTING PROCESS EQUIPMENT
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2003-08-12 | IFEE |
Issue Fee Payment (PTO-85B) | 1 | View | |
| 2001-12-13 | TRNA |
Transmittal of New Application | 3 | View | |
| 2001-12-13 | A.PE |
Preliminary Amendment | 2 | View | |
| 2001-12-13 | SPEC |
Specification | 74 | View | |
| 2001-12-13 | CLM |
Claims | 9 | View | |
| 2001-12-13 | ABST |
Abstract | 1 | View | |
| 2001-12-13 | DRW |
Drawings-only black and white line drawings | 25 | View | |
| 2001-12-13 | OATH |
Oath or Declaration filed | 5 | View |
Inventors
Hirohisa Matsuki
Kawasaki, JAPAN
Hiroyuki Matsui
Kawasaki, JAPAN
Attorneys & Agents of Record
Classification
USPC
228/199
B23K35/38
H05K3/34
B23K2101/40
H10W72/01225
H10W72/922
H10W72/923
H10W72/07236
H10W72/012
H10W72/20
H10W72/016
H10W72/9415
H10W70/60
H10W72/251
B23K35/262
B23K35/268
B23K35/3618
H05K3/3489
Prosecution
- Examiner
- DUNN, COLLEEN P
- Art Unit
- 1725
- Customer No.
- 23850
- Docket No.
- 001307A
- Confirmation No.
- 1112
Foreign Priority
11-361275
·
1999-12-20
·
JAPAN
2000-245929
·
2000-08-14
·
JAPAN
Publication
- Pub. No.
- US20020076909A1
- Pub. Date
- 2002-06-20
Patent Term Adjustment
0days
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2015-04-27
CHANGE OF NAME
Recorded 2010-08-02
from
FUJITSU LIMITED
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2008-12-05
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Quick Facts
- Patent No.
- US 6,666,369
- App. No.
- 10/013,506
- Filed
- 2001-12-13
- Granted
- 2003-12-23
- Pub. No.
- US20020076909A1
- Examiner
- DUNN, COLLEEN P
- Art Unit
- 1725
- PTA
- 0 days
External Links