IP Library Granted Patent US 6,666,369
Granted Patent Utility
US 6,666,369 · Confirmation No. 1112

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, ELECTRONIC PARTS MOUNTING METHOD AND HEATING/MELTING PROCESS EQUIPMENT

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Code Description Pages PDF
2003-08-12 IFEE Issue Fee Payment (PTO-85B) 1 View
2001-12-13 TRNA Transmittal of New Application 3 View
2001-12-13 A.PE Preliminary Amendment 2 View
2001-12-13 SPEC Specification 74 View
2001-12-13 CLM Claims 9 View
2001-12-13 ABST Abstract 1 View
2001-12-13 DRW Drawings-only black and white line drawings 25 View
2001-12-13 OATH Oath or Declaration filed 5 View
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Quick Facts
Patent No.
US 6,666,369
App. No.
10/013,506
Filed
2001-12-13
Granted
2003-12-23
Pub. No.
US20020076909A1
Art Unit
1725
PTA
0 days