Semiconductive compositions and cable shields employing same
View Patent ↗Novel semiconducting compositions for use in semiconductive cable shields having improved electrical properties as measured by ACLT and AWTT are described. The composition contains a base polymer and about 25 percent to about 45 percent by weight of carbon black having particle size of from about 15 nm to about 22 nm, Iodine number of from about 115 mg/g to about 200 mg/g, and DBP number of from about 90 cm 3 /100 g to about 170 cm 3 /100 g.
1. A cable comprising a conductive core and a semiconducting layer surrounding the conductive core, said semiconducting layer comprising:
about 55 percent to about 75 by weight of a base polymer; and
about 25 percent to about 45 percent by weight of carbon black having particle size of from about 15 nm to about 22 nm, an Iodine number of from about 115 mg/g to about 200 mg/g, and a DBP number of from about 90 cm 3 /100 g to about 170 cm 3 /100 g, wherein said cable has an accelerated cable life testing (ACLT) Weibull Beta value of 1.5 or more.
2. The cable of claim 1 , wherein the particle size is from about 18 nm to about 21 nm.
3. The cable of claim 1 , wherein the Iodine number is from about 120 mg/g to about 150 mg/g.
4. The cable of claim 1 , wherein the tint strength is at least about 95%.
5. The cable of claim 1 , wherein the particle size is about 20 nm and the Iodine number is from about 125 mg/g to about 150 mg/g.
6. The cable of claim 1 , wherein the carbon black is present in an amount of from about 30 percent to about 40 percent by weight.
7. The cable of claim 1 , wherein the base polymer is present in an amount of from about 60 percent to about 70 percent by weight.
8. The cable of claim 1 , wherein the base polymer is selected from copolymers of ethylene and a mono-unsaturated ester, copolymers of ethylene and one or more α-olefins having three to six carbon atoms, EPR and EDPM rubbers, low density polyethylene, and linear low density polyethylene.
9. The cable of claim 1 , wherein the base polymer is ethylene vinyl acetate.
10. The cable of claim 9 , wherein the ethylene vinyl acetate has a vinyl acetate content of from about 18 percent to about 20 percent.
11. The cable of claim 1 , wherein the base polymer is ethylene/I-butene and has a density of from about 0.85 g/cm 3 to about 0.95 g/cm 3 .
12. A semiconducting composition comprising:
about 55 percent to about 75 by weight of a base polymer; and
about 25 percent to about 45 percent by weight of carbon black having a particle size from about 15 nm to about 22 nm, an Iodine number of from about 115 mg/g to about 200 mg/g, and a DBP number from about 90 cm 3 /100 g about 170 cm 3 /100 g, wherein a semiconductive shield made from the composition has an accelerated cable life testing (ACLT) Weibull Beta value of 1.5 or more.
13. The semiconducting composition of claim 12 , wherein the Iodine number is from about 125 mg/g to about 150 mg/g.
14. The semiconducting composition of claim 12 , wherein the tint strength is at least about 95%.
15. A semiconducting composition according to claim 12 , wherein said semiconductive shield made from the composition has an accelerated cable life testing (ACLT) Weibull Beta value of 3.0 or more.