Granted Patent
Utility
US 6,569,535
· Confirmation No. 4094
SILICON WAFER AND EPITAXIAL SILICON WAFER UTILIZING SAME
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-12-18 | TRNA |
Transmittal of New Application | 3 | View | |
| 2001-12-18 | SPEC |
Specification | 27 | View | |
| 2001-12-18 | CLM |
Claims | 4 | View | |
| 2001-12-18 | ABST |
Abstract | 1 | View | |
| 2001-12-18 | DRW |
Drawings-only black and white line drawings | 9 | View | |
| 2001-12-18 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Hiroki Murakami
Saga, JAPAN
Kazuyuki Egashira
Saga, JAPAN
Attorneys & Agents of Record
Classification
USPC
428/446
C30B15/00
C30B29/06
Y10T428/21
C30B15/14
C30B15/203
C30B15/206
Prosecution
- Examiner
- STEIN, STEPHEN J
- Art Unit
- 1775
- Customer No.
- 23850
- Docket No.
- 011645
- Confirmation No.
- 4094
Foreign Priority
2000-387045
·
2000-12-20
·
JAPAN
Publication
- Pub. No.
- US20020081440A1
- Pub. Date
- 2002-06-27
Patent Term Adjustment
-2days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2002-07-05
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-12-18
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Quick Facts
- Patent No.
- US 6,569,535
- App. No.
- 10/017,295
- Filed
- 2001-12-18
- Granted
- 2003-05-27
- Pub. No.
- US20020081440A1
- Examiner
- STEIN, STEPHEN J
- Art Unit
- 1775
- PTA
- -2 days
External Links