IP Library Patent Application 10020050
Patent Application Utility Small
App. No. 10/020,050 · Confirmation No. 4509

LOW DEFECT METHOD FOR DIE SINGULATION AND FOR STRUCTURAL SUPPORT FOR HANDLING THIN FILM DEVICES

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗
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Code Description Pages PDF
2001-12-13 TRNA Transmittal of New Application 2 View
2001-12-13 SPEC Specification 15 View
2001-12-13 CLM Claims 12 View
2001-12-13 ABST Abstract 1 View
2001-12-13 DRW Drawings-only black and white line drawings 8 View
2001-12-13 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
10/020,050
Filed
2001-12-13
Granted
2003-06-03
Examiner
LE, DUNG ANH
Art Unit
2819
PTA
-6 days