Patent Application
Utility
Small
App. No. 10/020,050
· Confirmation No. 4509
LOW DEFECT METHOD FOR DIE SINGULATION AND FOR STRUCTURAL SUPPORT FOR HANDLING THIN FILM DEVICES
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-12-13 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-12-13 | SPEC |
Specification | 15 | View | |
| 2001-12-13 | CLM |
Claims | 12 | View | |
| 2001-12-13 | ABST |
Abstract | 1 | View | |
| 2001-12-13 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2001-12-13 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
David Xuan-Qi Wang
San Diego, CA
Jason Yao
San Diego, CA
Attorneys & Agents of Record
Classification
USPC
438/460
B81C1/00873
H10P72/7416
H10P54/00
H10P72/7402
H10P72/74
B81C1/00896
Prosecution
- Examiner
- LE, DUNG ANH
- Art Unit
- 2819
- Customer No.
- 31644
- Docket No.
- 1064 USA
- Confirmation No.
- 4509
Patent Term Adjustment
-6days
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-12-13
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Quick Facts
- App. No.
- 10/020,050
- Filed
- 2001-12-13
- Granted
- 2003-06-03
- Examiner
- LE, DUNG ANH
- Art Unit
- 2819
- PTA
- -6 days
External Links